Wafer Capability

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University Silicon Wafer for Production

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Wafer Capabilities

Our wafer capabilities are broad. Below is just some of what we can do.

  • <25.4mm-300mm Wafers
  • Metal depostion
  • Processess - Strip, etch, lapping, laser scribe, polish, clean
  • TTV <1um
  • LPD >32nm
  • Films - Cu, Ti, Fe, V, TiN, Cr, Al, Ta, SiO, Ti, Zr 100%
  • Wafer Inspection

Let us know what we can quote for you!