Ultra-Thin Silicon Wafers 1 Micron TTV, Low Roughness

university wafer substrates

Suspended Silicon Membranes

A NanoEngineering PhD candidate requested the following quote:

I am wondering if you have suspended silicon membrane (thickness around 5-10um)?

or the Ultra Thin Silicon 5um Thick sample provided in your excel sheet, is the silicon suspended or deposited on a wafer? 

Reference #244176 for specs and pricing.

What are Ultra-Thinned Silicon Wafer Application?

Standard silicon wafers are too thick and bulky for many applications, which can lead to problems with size, weight, and performance.

Solution: Our ultra-thin silicon wafers are perfect for a wide range of applications where traditional silicon wafers just won't do. With thicknesses ranging from 5µm to 100µm and diameters from 5mm to 6", our thin Silicon wafers are true mirror finish DSP, good surface flatness, haze-free, void-free, and have low surface Roughess (RMS) (typical 1-2nm) and an ultra-flat TTV typically less than +/-1µm.

Ultra-Flat or Call them MEMS wafers! We have them! In Stock and ready to ship!

150mm (6") Thin Silicon Wafers Special

Contact us for pricing.

  • 100um+/-10um 6" thin Silicon, SSP, $ each, minimum order 5 wafers.
  • 100um+/-5um 6" thin Silicon, DSP, $ each, minimum order 5 wafers.
  • 100um+/-1um 6" thin Silicon, DSP, $ each, minimum order 10 wafers.
  • 25um+/-1um 6" thin Silicon, DSP, $ each, minimum order 5 wafers.

Get Your Quote FAST! Or, Buy Online and Start Researching Today!





Is It Possible to Scribe and Break Thin Silicon (Si) Wafers?

A photonics researcher asked the following:

Question:

I would like to scribe and break thin (~100 um) Si wafers in such a way that the surface and cleaved edges are at right angles.  If this is possible I would purchase thinned Si wafers and, using our scribe and break tool, form 11 x 4 mm2 rectangles and use these in our diode laser facet coating process.

Answer:

YES, if you buy (100) orientation wafers {not (111) and not (110)} then they will cleave parallel and perpendicular to their Primary Flat. You can scribe and break wafers 100µm and even 1,000µm thick.

Standard wafer diameters and thicknesses are 50.8mmØ×280µm, 76.2mmØ×380µm, 100.0mmØ×525µm, 125.0mmØ×625µm, 150.0mmØ×675µm, anything thinner than that costs more. The larger the diameter, the more difficult it is to achieve 100µm thickness. At the same time the larger the diameter the more efficiently its area is used to make 11×4mm rectangles.

Please decide on the diameter and thickness that you need and on the number of wafers that you require and we shall be happy to give you a price quote.​

Reference # 206340 for specs and pricing.

Thin Silicon Wafers with Oxide for Nano-Fabrication Research

A bioengineering student requeste a quote for the following:

I am looking for thin silicon and silicon oxide wafers to be etched in our nano-fabrication facility. I want the wafers as thin as possible without being very expensive. I need the thickness to be in the range of 25um to 250um. Our lab will need to purchase 5-25 wafers at a time. I searched with the keywords "flat silicon wafer vendor".

Reference #209540 for specs and pricing.

Thin Silicon Wafers for MEMS

MEMS devices are used in a variety of industries, but their fabrication is delicate and time-consuming.

The most common way to make MEMS devices is to use a silicon wafer as the substrate. However, these wafers are very thin and can easily be damaged.

Solution: Our silicon wafer thinner than a human hair can be used to fabricate MEMS devices without damaging the substrate. This will save you time and money while ensuring that your devices are made with the highest quality materials.

silicon wafer thinner than a human hair

Thin Silicon With Low Surface Roughness

A postdoc requested a quote for the following:

Could I get the quote of a 4 inch thin silicon wafer with a thickness of 50um/+-5um and 100um/+-5um for minimum order? What is the surface roughness? I need roughness of 1~2 nm.

When I check other websites, the surface roughness of silicon wafer with prime level is about 0.5 nm. We need this level for the top side because we will make the optical waveguide with very low scattering loss. For the backside, the surface roughness of 1~2 nm is no problem. Could you provide the thin silicon wafer with this spec?

Reference #248929 for specs and pricing.

Thin Silicon for Acoustofluidics Research

A Ph.D. candidate researching acoustofluidics requested a quote for the following.

We combine microfluidics with acoustics to manipulate particles in a fluid cavity. would like to fabricate very thin microfluidic channels in silicon, which I can look through. Therefore, I need a Silicon/Glass Wafer with 30-50 µm Silicon thickness on top of a Glass Wafer with 20-1000 µm thickness. Do you have such wafers?

Reference #251230 for specs and pricing.

What is Acoustofluidics?

Acoustofluidics is a multidisciplinary field that combines acoustics (the study of sound waves) and fluid mechanics (the study of fluids in motion). It involves the use of sound waves to manipulate and control fluids and suspended particles within those fluids at micro and nanoscales. This field leverages the interaction between sound waves and fluids to achieve precise control over fluid flow, mixing, particle sorting, and other processes in microfluidic systems.

Key applications and principles of acoustofluidics include:

  1. Particle Manipulation: Using acoustic waves to trap, move, or sort particles within a fluid. This is often used in biomedical applications for sorting cells or other biological particles.

  2. Fluid Mixing: Enhancing the mixing of fluids at small scales, where traditional mixing methods are less effective, by using acoustic waves to induce fluid motion.

  3. Acoustic Streaming: Generating steady fluid flows using the interaction of sound waves with the fluid, which can be used for pumping or mixing fluids in microfluidic devices.

  4. Cell and Particle Sorting: Separating cells or particles based on their size, density, or acoustic properties using standing acoustic waves in microfluidic channels.

  5. Bioanalysis and Diagnostics: Implementing acoustofluidic techniques in lab-on-a-chip devices for applications such as blood analysis, pathogen detection, and other diagnostic procedures.

  6. Acoustic Levitation: Using sound waves to levitate small droplets or particles, allowing for contactless manipulation and analysis.

Acoustofluidic systems typically involve devices like ultrasonic transducers, microfluidic channels, and specialized substrates that can generate and control acoustic fields. The precise control and manipulation capabilities offered by acoustofluidics make it a powerful tool for a variety of scientific and industrial applications.

Free Standing Thin Silicon Wafers

We offer freestanding super thin silicon wafers with thicknesses ranging from 5µm to 100µm and with example of thin siliconi wafer in packagediameters from 5mm to 6. The thin Silicon wafers are true mirror finish DSP, good surface flatness, haze-free, void-free, and have Low Surface Roughess (RMS) (typical 1-2nm) and an ultralow TTV typically less than +/-1µm.

 

Thin Silicon Applications

 

The development of free-standing thin silicon wafers is an integral part of semiconductor manufacturing. These wafers are fabricated using a process known as epitaxial growth. This technology enables higher yield and lower polysilicon usage in the fabrication process. In addition, these devices reduce capital costs associated with the manufacturing of silicon modules. These advantages are important for the industry and the end-user. The project is funded through the National Science Foundation's Breakthrough Ideas program.

The process of forming these films on silicon wafers is based on self-limiting electrostatic interactions. Regardless of the size of the substrate, the process allows the formation of large thin films. The amount of reagents used in this process determines the maximum achievable thickness. This process allows for a wide range of scalability. The only limits to the size of these thin films are the deposition equipment and the polymer's intrinsic strength.

In contrast, super-thin films are made on thin LDPE films. The thickness of these films can range from just a few microns to several centimeters. The thickness of the films can be as low as five microns. The polymer also reduces the contact recombination. Furthermore, the thickness of the films can be very large, up to 100 mm. The sacrificial layers are usually limited to a few square millimeters.

Lab-On-Chip ELISA

The simplicity of a Lab-On-Chip Enzyme-Linked Immunosorbent Assay (ELISA) instrument makes it very attractive for researchers. The chip is made silicon lab on a chip elisaup of a series of wells with two valves for selecting reagents and a syringe pump for pulling solutions. There is a flow sensor that monitors the flow of the reagents. A specially developed control board connects the instrument to a laptop computer for operation. A reagent cartridge contains ten reagents that can be changed as required. Additional components, such as blocking buffer or stopping solution, are optional.

Compared to a conventional 96-well plate, the Lab-On-Chip ELISA has very low assay variation. The LOD is 10 pg/mL, and the assay takes a few hours. A typical ELISA-LOC uses six aliquots of sample, which is equivalent to two microwells. The second aliquot is inserted at the inlet of the microchannel, causing a pumping effect.

The spirals on the chip correspond to the wells in a 96-well plate. Each spiral is about the diameter of a microwell. Commercial ELISA readers can detect ELISA signals from these spiral sites. The chip is fixed in a standardized position on the plate reader adapter. The instrument can be used for chemiluminescence or fluorescence measurements. If it has a chemiluminescence sensor, the measurement can be conducted in an epi-mode.

The current chip design uses three internal calibration points for each test. A typical 96-well plate uses eight calibration concentrations, while Lab-On-Chip ELISA requires three internal calibration points. The calibration curve of a Lab-On-Chip ELISA is not linear over the entire assay range. Often, a five-PL or 4-PL curve fitting method is used. These new ELISA techniques are targeted at sensitive and fast tests.

A Lab-On-Chip ELISA has many advantages. It is an easy way to produce complex, 3D-microfluidic devices. These devices have multiple advantages over traditional ELISA. The main advantage is that they can be designed with a plethora of materials. Moreover, they are very inexpensive. The advantage of these instruments is that they are fast and accurate. They are compatible with existing microfluidic systems.

Unlike conventional ELISA, a Lab-On-Chip ELISA does not require a conventional 96-well plate. The system can work with any stepwise immunoassay. However, the dilution factor of the primary antibodies must be optimized in order to make them specific for a particular antigen. There are two main approaches to this problem. Firstly, the chemical modification of the primary antibody.

The microfluidic method is a good way to create an ELISA-LOC. It can be done on a microfluidic platform. It has the added benefit of being very fast and highly sensitive. It is also ideal for research and clinical purposes. It can be used for many applications. There are currently no limitations to its application in diagnostics. The development of a Microfluidic ELISA can continue to improve laboratory processes and the quality of diagnostics.

The microfluidic platform is more accurate. It can detect the presence of specific antibodies while eliminating non-specific ones. This is a major advantage compared to conventional ELISAs that require the use of a 96-well plate. Furthermore, the microfluidic platform can be easily calibrated using a commercial ELISA reader. The chip can be read in either chemiluminescence or fluorescence mode.

The Lab-On-Chip ELISA is an automated assay using off-the-shelf components. The prototype system does not use an optical detector. The commercially available system uses a chemiluminescent detection method. It does not require a 96-well plate. There are many advantages of the Microfluidic ELISA. Its low cost and high accuracy are the two main reasons for its popularity.

A unique microfluidic chip has been developed for multiple proteomic biomarkers. The chip features several microfluidic channels that enhance the assay kinetics and reduce the cost of reagents. Moreover, it can be made of various types of materials and features, including small sensors. The Lab-On-Chip ELISA is an innovative product for rapid and accurate diagnosis.

The CD-ELISA is a type of ELISA. The 96-well ELISA plate is a specialized ELISA device. The primary antibody and the blocking protein are pre-immobilized on the chip. The Ag solution and the substrate are loaded into the corresponding wells. The 96-well ELISA has several advantages over the conventional 96-well ELIsa plate. Its larger dynamic range and reduced assay time makes it ideal for a wide range of applications.

Thin Silicon Solar Cells Increase Efficiency and Reduce Cost

The most expensive part of conventional solar-cell arrays is the highly purified silicon, which accounts for about More efficient Solar Wafers, up to 51%!40 percent of the cost. So scientists and engineers have been trying to find ways to maximize the amount of power generated per unit of silicon while using less of it. One new approach has been developed by MIT scientists. The MIT researchers have created a pattern of inverted pyramids on the surface of the silicon to increase the surface area and reduce the thickness of the cell.

This design can be cost-effective and defect-tolerant, and is being investigated by researchers from Arizona State University. The technology can be used to make high-efficiency and highly reliable solar panels. Moreover, thin silicon solar cells can be produced faster and have lower capital costs. These are two important benefits of thin silicon solar cells. Andre Augusto, an associate research scientist at ASU, explained that the thin wafers are also capable of producing more wafers per machine, enabling the production of more panels with lower costs.

This type of design can be used to make a variety of solar cells. The thinness of the solar cell's front surface helps prevent the escaping wave from being too intense. The underlying crystalline silicon has high absorption, but is unable to absorb long wavelengths. Those wavelengths will pass through the solar cell, reflect on the rear mirror, and escape out the front surface. This weak-absorbing regime requires a special design of the layers' thicknesses, which cancel out reflected wave components and destructive interferences outside the cell.

The thickness of the silicon film ensures that the escaping wave is low, and the intensity is canceled by the back reflection. This process also reduces the rear-side recombination, which is common in silicon films. However, the front reflection of the spalled silicon film, with a thickness of 50 mm, causes the escaping wave to have a low intensity. Therefore, this technique is more practical.

A thin-silver solar cell's cost is largely determined by the silicon material. Usually, the thin-silver solar cell will cost a lot of money, so its development must be economical. By reducing the thickness of the silicon layer, the system will be more efficient. This technology will also help reduce the carbon footprint of the solar panel. It will also make thin-silver photovoltaic cells cheaper.

Polymorphous silicon solar cells are also lighter, reducing the weight of the solar cell. This reduces the weight and installation costs. Moreover, thin-silver solar cells can be made of standard silicon-chip processing equipment and do not require the use of new chemicals. The thickness of the silicon film is important. Its composition is important for efficient photovoltaics. Once it has been prepared, the silicon is deposited on the substrate, creating the solar cell.

The two types of thin silicon solar cells differ in their light-absorbing capacity. Both types of cells were able to absorb light at a wavelength of 400-550 nm, but the thickness of the silicon was more important for light-absorption efficiency. The EQE of the thin-silicon solar cell is about one-third less than that of a crystalline silicon panel. These solar cells are comparatively more efficient than crystalline ones.

The resulting thin-silicon solar cells are also lightweight. This reduces the weight of the solar cell, which in turn reduces the cost of installation. Furthermore, lightweight solar cells can be manufactured using standard silicon-chip processing equipment. They do not require any new chemicals or materials. These products are very effective and durable. They can be used in both commercial and residential applications. This technology has numerous advantages. There are no additional costs involved, except the cost of the construction.

The current density of the thin-silicon solar cells is approximately one-tenth of the cell of a traditional solar cell. These cells can operate at high temperatures and have high efficiencies. The energy produced from a single-pass cell has about the same energy as a dual-pass cell. A two-pass cell has about a third of the energy of a standard solar cell, whereas a three-pass cell is much more efficient.

* Micro Counter

Micro Cantilever Sensing and Actuation Components

A micro cantilever sensor is used in the analysis of temperature-dependent electrical signals. The cantilever has a sensitivity of 3.9 fg Hz-1. In this type of sensor, the length of the sensing and actuation layer is much smaller than the length of the cantilever. The resonant frequency of a cantilever is approximately 100 kHz.

The microcantilever is a monolayer-covered surface. The deflection occurs due to the interaction of the what does a micro-cantilever look likeelectrodes. The gap between electrodes can be varied up to ten volts. The applied voltage causes the cantilever to deflect. The current-limiting resistors reduce the sensitivity. Other topologies are available for the microcantilever.

The main challenge in biostress detection is the measurement of nanometers between the electrodes. The manufacturing process involves the use of an etching process that makes it difficult to obtain an accurate gap. The resulting nanometer-wide gap is crucial in achieving accurate measurements. A feedback circuit controls the cantilever's position, thus eliminating the nanometer gap. The reliability of the microcantilever sensor is also discussed.

The piezoelectric MCL is an important element of microcantilever sensors. These devices are used to measure touch-sensitive surfaces. They consist of a PZT layer that was fabricated by hydrothermal method and placed on a titanium substrate. The top and bottom layers serve as sensing and actuation layers. The position of the sensing and actuation layers determines the sensitivity of the cantilever. The two ends of the cantilever are placed at zero strain for maximum sensitivity.

Thin Silicon Photo Dynamic Therapy Laser and Its Application

This work shows that the spectral properties of a thin silicon Photo Dynamic Therapy Laser are influenced by the hydrogen concentration in the substrate. The results showed that the presence of hydrogen in the thin silicon layer is reduced when a high-intensity laser irradiation is used. The reduced concentration can be seen in Figure 7.4 a). The treatment time is also affected by the temperature. The treatment temperature is also associated with the shift in the subbandgap energy.

The temperature varies a lot depending on the scanning direction and position of the laser. For further experiments, the position and length of the treated surface were optimized. This result is shown in Appendix A. The measurements are consistent. Moreover, this type of treatment is effective in treating several cancer types. However, it is important to note that there are no clinical trials yet. This is because of the uncertainty involved in interpreting the results.

Several limitations of the treatment volume are apparent. The therapeutic volume of the laser is small, at one centimeter. These problems may be overcome by introducing other techniques to increase the coverage area. Using multiple LEDs with different wavelengths could be a better approach. This could make it possible to treat many more tumors at the same time. This could help in reducing the risks of invasive procedures and the associated costs.

Thin Silicon Wafers for Optical MEMS

Optical MEMS fabrication requires thin silicon wafers that are made of ultra-pure fused silica. The ultra-high purity of this material is necessary for high-performance optoelectronic systems. It is also used in semiconductor manufacturing processes due to its low trace metal and OH content. Various diameters and thicknesses are available at UniversityWafer, Inc.

This semiconductor process is widely used in automotive applications, such as tire pressure monitoring systems. It also enhances the manufacturing of semiconductor wafers used in automotive chips. The growing demand for MEMS devices has led to the production of more advanced substrates for this industry. The market for electric vehicles is also thriving in developed and developing regions. With increasing consumer awareness and increased sales of electric vehicles, the need for MEMS is inevitable.

Optical MEMS applications are being created by fabricating thin silicon wafers made from SOI. The SOI process involves depositing a thin layer of silicon on top of an insulating layer. The silicon layers in SOI wafers are much more efficient at reducing heat. As a result, they can be used in high-speed, high-performance optics, and a wide variety of other applications.

The fabrication of MEMS using thin silicon wafers is a challenging process. However, the process is increasingly becoming more sophisticated and affordable as technology advances. The most commonly used manufacturing technologies for making electronics include etching, molding, and plating. Electro discharge machining (EDM) is a technique used to fabricate small devices that are highly flexible. It also enables the production of optical MEMS in high volumes.

Moreover, the ultra-thin silicon wafers are capable of allowing high-quality optical MEMS to be manufactured. They can also be manufactured on custom silicon wafers. Among the platform options for MOEMS are BSOI wafers, which are made by bonding two silicon flakes together. These fabricated thin silicon spheres are ideal for the manufacturing of high-performance MEMS and optical MEMS.

Thin silicon wafers can be manufactured according to specific customer requirements. The diameter and thickness can be customized. The process can be performed by using a special bonding technology. Afterwards, the thin silicon wafers can be patterned with cavities and through holes. These patterned thin silicon spheres can be used to make optical MEMS. Moreover, they can be manufactured for optical MEMS.

These thin silicon wafers are ideal for manufacturing thin membranes. They can replace standard SOI wafers and can be used to develop new technologies. In addition, Plan Optik has added Silicon-On-Glass wafers to its stock of silicon wafers. Both 150 mm and 200 mm SOG spheres are available with thin-silicon-on-glass bases.

In addition to these properties, SOG wafers are suitable for fabrication of optical membranes. They are also a viable alternative to standard SOI wafers, which are prone to damage during processing. These thin-silicon-on-glass (SOG) wafers have high-insulation properties and can be used to develop new technologies. The companies that manufacture SOG wafers have a wide range of stock-wafers.

For Optical MEMS, Thin Silicon Wafers are used. It is possible to manufacture the optical devices from these wafers. In addition, it is possible to manufacture the optical devices from the thin silicon on glass base. By using these wafers, you will be able to achieve better performance and minimize cost. These components will help you achieve better imaging and improve your accuracy.

The optical MEMS process starts with the production of thin silicon wafers. This is the most cost-effective way to produce these optical devices. The process is easy to replicate and requires little expertise and time. In addition, the silicon wafers are easily compatible with other materials, which makes them compatible with optical MEMS. These products will also reduce the space requirement in your device. You can use them in both high-resolution and low-resolution optics.

A thin silicon wafer is a flexible substrate. Its optical properties are enhanced by a microfloat process. It is commonly used in a variety of different electronics applications, including power devices and CMOS image sensors. Other applications of thin silicon wafers include automotive and consumer electronics. Aside from being versatile, it also offers a wide range of advantages. If you are looking for a flexible substrate, you should look for a company that specializes in this material.

University Wafer along with our partners now specializes optical MEMS and specialty silicon products. These products and services include

  •  Deformable mirrors for adaptive optics
  • Large format ASIC drivers for deformable mirrors
  • MEMS, telecom, instrumentations, and piezoelectrics
  • Speciality silicon products such as super thin silicon wafers
  • Silicon nitride TEM windows/grids
  • PMN-PT/Silicon Unimorphs for optics
  • MEMS, measurement, and piezoelectric industries
  • Wafer services including bonding, coating, grinding/lapping/polishing, and wafer dicing

Thin Silicon Wafer 5μm, 10μm, 25μm, 50μm 100μm and more!

We have a large in stock inventory of super-thin Silicon ranging from 5um, 25um, 50um and so on.
Our super-thin silicon production is based on a proprietary combination of the following

  • Wafer Bonding
  • Lapping
  • Polishing
  • Debodning Process

Diameter/dimension range from <25.4mm - 150mm, larger is some cases.
The thin wafers are haze and void free. They have low surface roughness of 1-2nm and TTV +/-1um. 

Rigid Silicon Wafer Ring for Easy Handling

We can also supply an attachement with rigid wafer ring for our thin silicon wafers. This allows for easy handling.

We can also provide the following services on our thin wafers

  • Wafer Dicing
  • Silicon wafer lapping and polishing to 5-50um thickness
  • Wafer Bonding to mate a cavity wfer with a bare wafer
  • PECVD Nitride, Low Stress Nitride, Thermal Oxide and LS Oxide on Silicon Including super thin silicon wafers
  • Ebeam and thermal evaporation of metal coatings (Ti, Cr, Au, Pt, Pd, Al, Cu, Ag etc) on our wafers including our super-thin wfers
  • IC assembly (wafer dicing, die attachment, wire bonding, flip chip bonding)