Wafer Capabilities
Our wafer capabilities are broad. Below is just some of what we can do.
- <25.4mm-300mm Wafers
- Metal depostion
- Processess - Strip, etch, lapping, laser scribe, polish, clean
- TTV <1um
- LPD >32nm
- Films - Cu, Ti, Fe, V, TiN, Cr, Al, Ta, SiO, Ti, Zr 100%
- Wafer Inspection
Let us know what we can quote for you!