Thin Film Coated Wafers: Sputtering & Evaporation

Custom Vacuum Deposition (CVD) services for R&D and production. We coat Silicon, Glass, and Sapphire wafers with high-purity metals, oxides, and nitrides.

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⚡ Rapid Metal Coatings

Gold (Au) / Titanium (Ti)
Standard adhesion stack: 50nm Ti + 100nm Au.
Available on Silicon, Glass, or Sapphire.

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Substrates We Coat

  • Silicon Wafers: Prime, Test, and Mechanical grades.
  • Glass Wafers: Fused Silica, Borofloat 33, Soda Lime.
  • Sapphire: C-plane, R-plane, and A-plane.
  • Ceramics: Alumina (Al2O3) and Aluminum Nitride (AlN).
  • SOI Wafers: Silicon-on-Insulator substrates.
  • Customer Supplied: We can coat your own wafers.

Thin Film Deposition Capabilities

UniversityWafer provides both R&D and production-scale coating services using advanced Sputtering (Perkin/Elmer 4410, MRC 903) and Electron Beam (E-Gun) Evaporation systems.

1. Sputtered Films Inventory

Sputtering is ideal for alloys, dielectrics, and achieving excellent adhesion.

Category Materials Available
Conductive Metals Aluminum (Al), Gold (Au), Silver (Ag), Copper (Cu)
Adhesion Layers Titanium (Ti), Chrome (Cr), Ti-W (90/10)
Refractory Metals Molybdenum (Mo), Tungsten (W), Tantalum (Ta), Niobium (Nb)
Magnetic Metals Nickel (Ni), Iron (Fe), Cobalt (Co)
Dielectrics (Oxides) SiO2, Al2O3, TiO2, ITO (Indium Tin Oxide)
Nitrides Silicon Nitride (SiN), TiN, TaN

2. E-Beam Evaporated Films

Evaporation allows for high-purity deposition and lift-off processing.

Category Materials Available
Noble Metals Platinum (Pt), Palladium (Pd), Gold (Au)
Soft Metals Indium (In), Tin (Sn)
Oxides Hafnium Oxide (HfO2), Yttrium Oxide (Y2O3), Indium Oxide (In2O3)
Fluorides MgF2, CaF2, BaF2 (for optical coatings)

Application Spotlights & Case Studies

🔋 Case Study: Carbon Coatings for Conductivity

Challenge: A researcher needed a conductive, amorphous Carbon thin film (1-2µm) on 4-inch SOI wafers. The goal was to create an electrically conducting film that was not shiny.

Solution: We utilized a specialized sputtering process to deposit Carbon. While 1-2µm is difficult due to stress, we successfully deposited ~8,000Å (0.8µm) with a refractive index of n=1.25 (indicating a Diamond/Graphite mix). The measured film stress was 913 MPa (compressive).

💎 Case Study: Diamond-Like Carbon (DLC)

Application: Hard coatings for wear resistance.

We supplied 100mm Silicon wafers coated with single-crystal Diamond films (CVD epi). The client requested thicknesses of 0.25µm and 0.50µm on Si(111) substrates, which are preferred for subsequent etching of pyramidal holes.

⚡ Case Study: Electrochemical Impedance

Application: Bio-sensing electrodes.

Researchers studying amyloid B-Oligomers utilized our Gold-Coated Silicon Wafers as stable electrodes for Electrochemical Impedance Spectroscopy (EIS). The inert nature of gold on silicon provides a perfect platform for sensitive biological measurements.

Understanding the Process

Sputtering

Sputtering involves ejecting material from a "target" source onto the wafer using high-energy plasma. It offers excellent step coverage and adhesion, making it ideal for coating complex topographies or MEMS devices.

chematic diagram of the sputtering deposition process showing argon plasma ions striking a target cathode and ejected atoms coating a wafer substrate anode.

E-Beam Evaporation

An electron beam melts the source material in a vacuum, causing it to evaporate and condense on the wafer above. This method is preferred for "lift-off" processes and depositing high-melting-point metals like Tungsten or Platinum.

Schematic diagram of the electron beam evaporation process showing an electron gun, magnetic field, crucible with source material, vapor stream, and wafer substrate.