Partial Silicon Wafer Sale! Buy as few as One Wafer!

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See below for our Partial Silicon Wafer Cassettes.

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Partial Silicon (Si) Wafer Cassettes

See below for our partial cassettes of 150mm, 100mm, 76.2mm, 50.7mm, 25.3mm, CZ and FZ, SSP and DSP ready to ship!

150mm Silicon Wafers Partial Cassette

Item # Type/Dopant Ori Dia Thick Polish Resistivity Comments
TS006 P/B [100] 6" 525 ±15 P/E MCZ 0.01-0.02 {0.015-0.017} SEMI Prime, 1 SEMI Flat 57.5mm @ <011>±0.5°, Non-standard Edge profile, Oxygen=(11-13)ppma, Carbon<1ppma, Empak cst
TS004 P/B [100] 6" 675 ±15 P/E MCZ 0.01-0.02 {0.013-0.017} SEMI Prime, 1 SEMI Flat 57.5mm @ <011>±0.5°, Oxygen=(3-9)ppma, Carbon<1ppma, Back-side: Acid etch, Empak cst
7038 P/B [111] ±0.5° 6" 875 P/E FZ >10,000 SEMI notch Prime, Empak cst, Lifetime>1,000μs
6898 P/B [111] ±0.5° 6" 1,000 P/E FZ >5,000 SEMI Prime, 1Flat (57.5mm), Empak cst
7233 N/Ph [100] ±1° 6" 675 P/P FZ 4,300-8,300 SEMI Prime, 1Flat (57.5mm), Empak cst
L625 N/Ph [100-6° towards[111]] ±0.5° 6" 625 P/E FZ >3,500 SEMI Prime, 1Flat (57.5mm), Empak cst
E700 N/Ph [100-6° towards[111]] ±0.5° 6" 675 P/P FZ >3,500 SEMI Prime, 1Flat (57.5mm), Empak cst
D982 N/Ph [100-6° towards[111]] ±0.5° 6" 675 BROKEN FZ >1,000 SEMI notch Broken - one piece ~50% of wafers other pieces ~20% of wafer, Empak cst
7122 N/Ph [100] 6" 500 ±10 P/P FZ 50-70 SEMI Prime, 1Flat, Empak cst
5325 N/Ph [100] 6" 725 P/P FZ 50-70 {57-62} SEMI Prime, 1Flat (57.5mm), Lifetime=15,700μs, Empak cst
7053 N/Ph [100] 6" 2,000 P/P FZ 50-70 SEMI Prime, 1Flat (57.5mm), Cassettes of 10 + 6 wafers
6883 N/Ph [100] 6" 625 ±5 P/P FZ 40-90 SEMI Prime, 1Flat (57.5mm), TTV<3μm,, Empak cst
G883 N/Ph [100] 6" 650 ±5 P/P FZ 40-90 SEMI Prime, 1Flat (57.5mm), TTV<3μm,, Empak cst
F883 N/Ph [100] 6" 675 ±5 P/P FZ 40-90 SEMI Prime, 1Flat (57.5mm), TTV<3μm,, Empak cst
S5622 N/Ph [100] 6" 1,300 ±10 E/E FZ 0.01-0.05 SEMI notch, Empak cst
G228 N/Ph [111] ±0.5° 6" 300 ±15 BROKEN FZ >6,000 Test,Broken into a dozen large pieces ranging from 65% of wafer to 5% and small pieces as well
7116 Intrinsic Si:- [100] 6" 675 P/P FZ >65,000 SEMI notch Prime, Empak cst
M526 Intrinsic Si:- [100] ±0.1° 6" 720 ±10 P/P FZ >10,000 SEMI Prime, 1Flat (57.5mm), TTV<3μm, Empak cst
7117 Intrinsic Si:- [111] ±0.5° 6" 875 P/P FZ >10,000 SEMI Prime, 1Flat (57.5mm), Empak cst
F613 P/B [110] ±0.5° 6" 300 P/P 20-25 SEMI TEST - scratched, can be repolished & thinned for extra fee, 2Flats, in unsealed Empak cst
4980 P/B [100] 6" 220 P/P 10--30 SEMI 1Flat (57.5mm), TEST grade (surface scratches & digs), TTV<4μm, Unsealed in Empak cst
L405 P/B [100] 6" 1,000 P/P 10--15 SEMI Prime, 1Flat (57.5mm), Empak cst, 4 Prime wafers plus 2 scratched wafers at no cost
E964 P/B [100] 6" 475 P/P 1--30 SEMI Prime, 1Flat (57.5mm), Empak cst
D964 P/B [100] 6" 500 P/P 1--30 SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5μm
5354 P/B [100-9.7° towards[001]] ±0.1° 6" 525 P/P 1-100 SEMI Prime, 1Flat (57.5mm) at <110>±0.1°, Empak cst
B420 P/B [100] 6" 675 P/P 1--5 SEMI Prime, 1Flat, Soft cst
N698 P/B [100] 6" 675 P/E 1-100 SEMI Prime, 1Flat (57.5mm), Empak cst
F162 P/B [100] 6" 2,000 ±50 P/P 1--35 SEMI Prime, 1Flat (57.5mm), Individual cst, Group of 6 wafers
E162 P/B [100] 6" 2,000 ±50 P/E 1--35 SEMI Prime, 1Flat (57.5mm), Group of 2 wafers, Back-Side polished with small scratches
7047 P/B [100] 6" 400 P/P 0.5-1.0 SEMI Prime, 1Flat (57.5mm), Empak cst
6005 P/B [100] 6" 320 P/E 0.001-0.030 JEIDA Prime, Empak cst
TS105 P/B [111-1.5°] ±0.35° 6" 675 P/EOx 0.001-0.002 {0.0017-0.0018} SEMI Prime, 1Flat (57.5mm), Back-side LTO 400±40nm, TTV<6μm, Empak cst
7314 N/Ph [100] 6" 1,280 P/P 10--35 SEMI notch Prime, Empak cst
6971 N/Ph [100-25° towards[110]] ±1° 6" 675 P/P 1-100 SEMI notch Prime, Empak cst, TTV<1μm
C716 N/Ph [100-28° towards[110]] ±1° 6" 700 P/P 1-100 SEMI Notch Prime, TTV<2μm, Empak cst
S5913 N/Ph [100] ±1° 6" 800 P/E 1--10 SEMI Prime, 1Flat (57.5mm), Empak cst
E089 N/Ph [100] 6" 1,910 ±10 P/P 1-100 SEMI Prime, 1Flat (57.5mm), TTV<2μm, in stacked trays of 2 wafers
F089 N/Ph [100] 6" 1,910 ±10 P/P 1-100 SEMI Prime, 1Flat (57.5mm), TTV<5μm, sealed in stacked trays of 1 + 3 wafer
G844 N/Ph [100] 6" 5,000 P/P 1--35 SEMI Prime, 1Flat (57.5mm), Individual cst

 

100mm Silicon Wafers Partial Cassette

C260 P/B [110] ±0.5° 4" 500 P/E FZ >15,000 {16,453-18,686} Prime, 2Flats, SEMI Flats, PF at<111>, SF at <111> 70.5° CW from PF, Empak cst
6268 P/B [110] ±0.5° 4" 500 P/E FZ >10,000 Prime, 2Flats, TTV<5μm, SEMI Flats, PF at<111>, SF at <111> 70.5° CW from PF, Empak cst
6269 P/B [100-4° towards[110]] ±0.5° 4" 525 P/E FZ >2,000 SEMI Prime, 2Flats, Empak cst, TTV<5μm
J178 P/B [100] 4" 1,000 P/P FZ >1,500 SEMI Prime, 2Flats, Empak cst
J846 P/B [100] 4" 225 P/P FZ 1-3 SEMI Prime, 2Flats, Empak cst, TTV<5μm, Lifetime<1,700μs
6100 P/B [100-6.0° towards[111]] ±0.5° 4" 350 P/P FZ 1-10 SEMI Prime, 2Flats, Empak cst, Lifetime >1,500μs
C213 N/Ph [110] ±0.5° 4" 525 P/P FZ >5,000 SEMI Prime, 2Flats, Empak cst
H411 N/Ph [100] 4" 380 P/E FZ 5,000-10,000 SEMI Prime, 1Flat, Lifetime>1,000μs, in Empak cassettes of 2 wafers
J724 N/Ph [100] 4" 425 C/C FZ >5,000 2Flats (p-type flats on n-type wafers), Empak cst
G050 N/Ph [100] 4" 525 P/E FZ 4,200-8,000 SEMI TEST (Bad Surface & Chips), Lifetime>1,400μs, 1Flat, in Empak cassettes of 7 & 7 wafers
6241 N/Ph [100] 4" 400 ±10 P/P FZ 3,100-6,800 SEMI Prime, 2Flats, TTV<5μm
2454 N/Ph [100] 4" 400 P/E FZ 2,000-6,500 SEMI Prime, 2Flats, Empak cst, Lifetime>1,000μs
W198 N/Ph [100] 4" 800 P/P FZ 2,000-3,000 SEMI Prime, 1Flat, TTV<10μm, Empak cst
S5798 N/Ph [100] 4" 915 ±10 E/E FZ 2,000-3,000 1Flat at [100], Empak cst
S6284 N/Ph [100] ±1° 4" 200 ±10 P/P FZ >1,000 SEMI Prime, 1Flat, TTV<1μm, in Empak cst
G158 N/Ph [100] 4" 400 ±10 P/P FZ >1,000 SEMI Prime, 2Flats, Empak cst, TTV<2μm
E290 N/Ph [100] 4" 200 ±10 BROKEN FZ 800-1,500 Broken P/E wafers, in various size pieces, Lifetime >1,000μs
O442 N/Ph [100] 4" 500 ±10 P/P FZ 50-70 SEMI Prime, 1Flat, Empak cst, with LM
M026 N/Ph [100] 4" 525 P/E FZ 10-15 SEMI Prime, 2Flats, Empak cst
6099 N/Ph [100-6°] ±0.5° 4" 350 P/P FZ 1-10 SEMI Prime, 2Flats, Empak cst, Lifetime>300μs
C170 N/Ph [111] ±0.5° 4" 500 P/E FZ 10,000-15,000 SEMI Prime, 1Flat, Empak cst, TTV<5μm
K845 N/Ph [111] ±0.25° 4" 675 P/E FZ 10,000-20,000 SEMI TEST (Light scratches), 1Flat, Lifetime>1,000μs, Empak cst,
1679 N/Ph [111] ±0.5° 4" 630 P/G FZ >7,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000μs, Back-side Fine Ground
B465 N/Ph [111] ±0.5° 4" 675 P/E FZ >7,000 SEMI, 1Flat, Lifetime>1,600μs, in Empak cassettes of 6 and 8 wafers
D465 N/Ph [111] ±0.5° 4" 675 P/E FZ >7,000 SEMI, 1Flat, in Empak, Lifetime>1,600μs
E465 N/Ph [111] ±0.5° 4" 675 P/E FZ >7,000 SEMI TEST (Scratches, in Unsealed Empak cassette), 1Flat, Lifetime>1,600μs
G845 N/Ph [111] ±0.25° 4" 675 P/E FZ 7,000-10,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000μs, Light scratches
6747 N/Ph [111] ±0.5° 4" 525 P/P FZ 5,000-10,000 SEMI Prime, 2Flats, Empak cst, Lifetime >1,000μs
D852 N/Ph [111-1° towards[110]] ±0.5° 4" 525 P/E FZ >5,000 SEMI TEST (scratches on back-side), 1Flat, Empak cst
6767 N/Ph [111] ±0.2° 4" 625 P/E FZ 5,000-8,600 SEMI Prime, 1Flat, Empak cst, TTV<5μm, Lifetime<1,000μs
D850 N/Ph [111] ±0.25° 4" 675 P/E FZ 5,000-7,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000μs
F845 N/Ph [111] ±0.25° 4" 675 P/E FZ 5,000-7,000 SEMI TEST (light scratches), 1Flat, Lifetime>1,000μs, in Empak
G773 N/Ph [111] ±0.5° 4" 525 P/P FZ >3,000 SEMI Prime, 2Flats, Lifetime>1,000μs, in Empak cassettes of 5, & 10 wafers
L845 N/Ph [111] ±0.25° 4" 525 P/E FZ 3,000-5,000 SEMI Prime, 1Flat, in Empak cassettes of 3, 3 & 4 wafers
M845 N/Ph [111] ±0.25° 4" 525 P/E FZ 3,000-5,000 SEMI TEST (light scratches), 1Flat, Empak cst
I192 N/Ph [111] ±0.5° 4" 290 ±10 P/P FZ 2,500-3,500 SEMI TEST (Surface defects), 2Flats, Empak cst
F278 N/Ph [111] ±1° 4" 380 P/E FZ 2,000-3,000 SEMI Prime, 1Flat, TTV<5μm, Lifetime>1,000μs, in Epak cassettes of 6 wafers
O942 N/Ph [111] ±0.5° 4" 525 P/P FZ 2,000-4,000 SEMI Prime, 2Flats, Empak cst
D717 N/Ph [111] ±0.5° 4" 525 P/E FZ 1,500-3,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,100μs
D236 N/Ph [111] ±0.5° 4" 525 P/E FZ 430-550 SEMI Prime, 1Flat, Empak cst, TTV<7μm
5739 N/Ph [112-5° towards[11-1]] ±0.5° 4" 765 P/P FZ ~100 SEMI Prime, 1Flat, Empak cst, TTV<3μm
7186 Intrinsic Si:- [110] ±0.5° 4" 500 P/E FZ >10,000 Prime, 2Flats, Empak cst
7082 Intrinsic Si:- [100] 4" 475 P/P FZ >20,000 SEMI Prime, 1Flat, Empak cst
I693 Intrinsic Si:- [100] 4" 500 P/P FZ >20,000 SEMI Test, 1Flat, TTV<3μm, Scratches on both sides, Empak cst
I218 Intrinsic Si:- [100] 4" 500 P/P FZ >20,000 SEMI Prime, 1Flat, Empak cst, TTV<1μm
6356 Intrinsic Si:- [100] 4" 500 P/P FZ >20,000 SEMI Prime, 1Flat, TTV<1μm, Empak cst
6648 Intrinsic Si:- [100] 4" 525 P/P FZ >20,000 SEMI Prime, 1Flat, TTV<2μm, Empak cst
T842 Intrinsic Si:- [100] 4" 525 P/E FZ >20,000 SEMI Test, Flat, Empak cst, TTV<8μm, Unsealed
D545 Intrinsic Si:- [100] 4" 790 ±2.5 P/P FZ >20,000 SEMI Prime, 1Flat, TTV<2μm, Empak cst
L847 Intrinsic Si:- [100] 4" 1,000 P/P FZ >20,000 SEMI Prime, 1Flat, Empak cst
K278 Intrinsic Si:- [100] 4" 3,000 ±50 P/P FZ >20,000 SEMI Prime, 1Flat, Individual cst
G444 Intrinsic Si:- [100] 4" 300 P/E FZ 16,000-20,000 SEMI Prime, 1Flat, Empak cst, Back-side polish is imperfect
E775 Intrinsic Si:- [100] 4" 615 ±10 C/C FZ >10,000 SEMI Prime, 1Flat, Empak cst
O749 Intrinsic Si:- [111] ±0.5° 4" 500 P/P FZ >25,000 SEMI Test, 1Flat, Empak cst, Scratches on both sides
E108 Intrinsic Si:- [111] ±0.5° 4" 500 P/P FZ >22,000 SEMI Prime, 1Flat, Empak cst
F736 Intrinsic Si:- [111] ±0.1° 4" 525 P/E FZ >22,000 SEMI Prime, 1Flat, Empak cst
R698 Intrinsic Si:- [111] ±0.5° 4" 500 P/E FZ >20,000 SEMI Prime, 1Flat, Empak cst, Extra 3 free non-prime wafers included with 4 prime wafers
H775 P/B [110] ±0.5° 4" 1,650 P/E 10--15 SEMI Prime, 1Flat, Individual cst
D636 P/B [110] ±0.5° 4" 750 P/E 1-100 SEMI Prime (back-side polished but not Prime), 2Flats, Empak cst, TTV<5μm, Bow/Warp<10μm
U091 P/B [100] 4" 680 ±10 P/P >30 SEMI Prime, 2Flats, TTV<1μm, Empak cst.
7127 P/B [100] 4" 350 P/E 10--20 SEMI Prime, 1Flat, Empak cst
I808 P/B [100] 4" 500 P/P 10--20 SEMI Prime, 2Flats, in single wafer cassettes, can be ordered singly
D153 P/B [100] 4" 3,000 P/P 10--15 SEMI Prime, 1Flat, Individual cst, Group of 7 wafers
F153 P/B [100] 4" 3,000 P/P 10--15 SEMI Prime, 1Flat, Individual cst
G511 P/B [100] 4" 300 P/P 8--12 SEMI TEST - Front-side poorly polished, 2Flats, Empak cst
TS019 P/B [100] ±1° 4" 300 ±5 P/E 7-14 {9.1-10.5} SEMI Prime, 2Flats, Empak cst
F986 P/B [100] 4" 1,600 P/P ~6 SEMI Prime, 1Flat, Individual cst
7305 P/B [100] 4" 300 P/P 5--10 SEMI Prime, 2Flats, Empak cst
F060 P/B [100] 4" 300 P/P 5--10 SEMI Test, 2Flats, Empak cst, Scratched and unsealed. Can be re-polished for extra fee
5727 P/B [100] 4" 380 P/E 5--10 SEMI TEST (in Opened cassette), 2Flats, Empak cst
D819 P/B [100] 4" 380 P/E 5--10 SEMI Prime, 1Flat, hard cst, Back-side slightly darker than normal
C815 P/B [100] 4" 380 BROKEN 5--10 Broken P/E Wafers, 1Flat, in Empak
D259 P/B [100] 4" 380 BROKEN 5--10 Broken P/E Wafers, 2Flats, in Empak
D649 P/B [100] 4" 380 BROKEN 5--10 Broken (largest piece is ~30%), 1Flat, in Empak
J109 P/B [100] 4" 525 P/P 5--10 SEMI Prime, 1Flat, Empak cst, TTV<1μm
E326 P/B [100] 4" 525 P/E 5--10 SEMI Prime, 1Flat, Empak cst, TTV<4μm, Bow<15μm, Warp<30μm, Cassettes of 6 and 11 wafers
7289 P/B [100] 4" 200 P/P 1--20 SEMI Prime, 1Flat, Empak cst
6273 P/B [100-4.0°] ±0.5° 4" 275 P/E 1--30 SEMI Prime, 1Flat, Empak cst, TTV<5μm
G997 P/B [100] 4" 300 P/P 1--10 SEMI Test, 2Flats, Empak cst, Surface Defects
E485 P/B [100-4° towards[110]] ±0.5° 4" 300 P/E 1--10 SEMI Test, 2Flats, Empak cst, Wafers with pits
G189 P/B [100] 4" 475 P/E 1--10 SEMI Prime, 2Flats, Empak cst, Epi edges for 150μm epi growth
F263 P/B [100] 4" 480 C/C 1--30 SEMI Test, 2Flats, Empak cst, UNPOLISHED WAFERS WITH EDGE CHIPS
K440 P/B [100] 4" 500 P/P 1--50 SEMI Prime, 2Flats, in Empak cst, Carbon content (0.9-1.1)E16/cc per ASTM F1319, Oxygen content (8.4-8.0)E17/cc per ASTM F1188.
F307 P/B [100] 4" 525 P/P 1--10 SEMI Test, 2Flats, Empak cst, Unsealed, dirt and defects on wafers
F485 P/B [100] 4" 525 P/E 1--20 Spotted defect wafers with three layers of SiO2 and Ge via Electron Beam Evaporation, 2Flats, Empak cst
4959 P/B [100] 4" 525 NP/PN 1--10 SEMI Prime, 2Flats, Empak cst, with 150nm of LPCVD Stoichiometric Silicon Nitride on bith sides
B273 P/B [100] 4" 620 ±1 P/P 1--50 Lasermark, SEMI Prime, 2 Flats, Empak cst, TTV<0.5μm, Bow<3μm, Warp<9μm
C273 P/B [100] 4" 620 ±1 P/P 1--50 Lasermark, SEMI Prime, 2 Flats, Empak cst, TTV<0.5μm, Bow<3μm, Warp<9μm
6347 P/B [100] 4" 1,200 P/P 1--15 SEMI Prime, 2Flats, Empak cst
D594 P/B [100] 4" 3,175 P/P 1--10 SEMI Prime, 2Flats, Individual cst, TTV<8μm
5737 P/B [100] 4" 890 ±15 P/P 0.5-10.0 SEMI TEST (Scratches), 1Flat, TTV<8μm, Empak cst
I046 P/B [100] 4" 250 P/P 0.1-0.5 SEMI Prime, 2Flats, Empak cst
E654 P/B [100] 4" 320 P/P 0.08-0.12 SEMI Test, 2Flats, Empak cst, TTV<2μm, SURFACE DEFECTS
7010 P/B [100] 4" 250 P/P 0.025-0.035 SEMI Prime, 1Flat, Empak cst, TTV<5μm
X090 P/B [100] 4" 300 ±7 P/P 0.014-0.021 Prime, 2Flats, Empak cst, TTV<1μm
F966 P/B [100] 4" 250 P/P 0.01-0.02 SEMI Prime, 2Flats, Empak cst
6349 P/B [100] 4" 525 P/E 0.01-0.02 SEMI Prime, 2Flats, Empak cst, TTV<5μm
7085 P/B [100] 4" 800 P/E 0.01-0.02 SEMI Prime, 2Flats, Empak cst
T155 P/B [100] 4" 525 P/POx 0.008-0.020 SEMI Prime, 2Flats, Empak cst
6952 P/B [100] 4" 3,100 P/P 0.006-0.009 SEMI Prime, 2Flats, Individual cst, Group of 4 wafers
5419 P/B [100] 4" 300 P/P 0.001-0.005 SEMI Test, 2Flats, Empak cst, Both sides with scratches
L419 P/B [100] 4" 300 P/P 0.001-0.005 SEMI Prime, 2Flats, Empak cst
6919 P/B [100] 4" 300 P/E 0.001-0.010 SEMI Prime, 2Flats, Empak cst
D919 P/B [100] 4" 300 P/E 0.001-0.010 SEMI TEST - scratches, in unsealed cst, 2Flats, Lasermark, Empak cst
6719 P/B [100] 4" 525 P/E 0.001-0.005 SEMI Prime, 2Flats, Empak cst, TTV<5μm
K173 P/B [100] 4" 525 BROKEN 0.001-0.005 Broken wafer (shattered into many pieces), 1Flat
G134 P/B [100] 4" 1,000 ±50 P/P 0.001-0.005 Prime, NO Flats, Empak cst
L135 P/B [100] 4" 2,000 ±50 P/P 0.001-0.003 Prime, NO Flats, Individual cst
I204 P/B [531] ±0.5° 4" 500 P/E 5--10 Prime, 1Flat, Empak cst
T205 P/B [331] ±0.5° 4" 500 P/E 5--10 Prime, 1Flat, Empak cst
K202 P/B [311] ±0.5° 4" 500 P/E 5--10 Prime, 1Flat, Empak cst
C203 P/B [211] ±0.5° 4" 500 P/E 5--10 Prime, 1Flat, Empak cst
I374 P/B [111] 4" 350 P/E 2--3 Prime, NO Flats, Empak cst
M620 P/B [111] 4" 1,000 P/P 1--10 SEMI Prime, 1Flat, Empak cst
D372 P/B [111-3°] 4" 400 P/E 0.015-0.018 SEMI Prime, 1Flat, Empak cst
G508 P/B [111] ±0.5° 4" 525 P/E 0.01-0.02 SEMI Prime, 1Flat, Empak cst, TTV<3μm, Bow<10μm, Warp<30μm
TS069 P/B [111-3.5°] ±0.5° 4" 525 ±15 P/E 0.007-0.009 {0.0071-0.0085} SEMI Prime, 1Flat, Empak cst, TTV<5μm
1223 P/B [111-3°] ±0.5° 4" 525 P/E 0.002-0.016 SEMI Prime, 1Flat, in Empak cassettes of 4 & 5 wafers
TS049 P/B [111-3.5°] ±1° 4" 300 ±15 P/E 0.001-0.002 {0.0018-0.0019} Prime, 1Flat, TTV<5μm, Free of Striations, Empak cst
TS012 P/B [111-3°] ±0.5° 4" 750 P/E 0.001-0.005 {0.0040-0.0041} SEMI Prime, 1Flat, Back-side: Acid Etch, Edge: R228, Empak cst
3623 N/Ph [110] ±0.5° 4" 525 P/P 20-80 SEMI Prime, 2Flats @ [111] - Secondary 70.5° CW from Primary, Empak cst
G538 N/Ph [110] ±0.5° 4" 500 P/P 3--10 SEMI Prime, TTV<10μm, Bow/ Warp<30μm, Primary Flat @ [111]±0.2°, Secondary @ [111] 70.5° CW from Primary, in Empak cassettes of 7 wafers
H725 N/Ph [110] ±0.3° 4" 525 P/P 3--10 SEMI Prime, TTV<10µm, Bow/ Warp<30µm, Primary Flat @ [111]±0.2°, Secondary @ [111] 70.5° CW from Primary, in Empak cassettes of 6 & 7 wafers
4024 N/As [110] ±0.5° 4" 275 P/P 0.001-0.005 SEMI TEST (Haze and scratches, TTV<15μm), Primary Flat at [111]±0.5°,
Secondary at 70.5°±5° CW from Primary, Empak cst
E024 N/As [110] ±0.5° 4" 275 ±10 P/P 0.001-0.005 SEMI Prime, 2Flats at [111] 70.5° apart, TTV<5μm, Empak cst
S5002 N/Ph [100] 4" 310 ±10 P/P 20-30 SEMI Test, 2Flats, Empak cst, Unsealed, Polished but dirty. Can be made prime for additional fee 
5892 N/Ph [100] 4" 350 P/P 20-23 SEMI Prime, 14 wafes with 2 flats, 7 with 1 flat, Empak cst
6662 N/Ph [100] 4" 700 P/E 14-18 Prime, NO Flats, Empak cst
G827 N/Ph [100] 4" 525 P/E 10--30 SEMI, 2Flats, in Empak cassettes of 7 & 7 wafers
5337 N/Ph [100-4° towards[111]] 4" 525 P/E 9--11 SEMI Prime, 2Flats, Empak cst
5171 N/Ph [100] 4" 224 P/E 5--10 SEMI, 2Flats, Empak cst
L758 N/Ph [100] 4" 500 P/P 4--6 SEMI Prime, 2Flats, Empak cst
M501 N/Ph [100] 4" 525 P/E 4--6 SEMI Prime, 2Flats, Empak cst
D830 N/Ph [100] 4" 350 ±10 P/P 3--5 SEMI Prime, 2Flats, Empak cst
E830 N/Ph [100] 4" 350 P/P 3--5 SEMI Test, 2Flats, Empak cst, Haze, pits, scratches
6501 N/Ph [100] 4" 525 P/P 3--9 SEMI Prime, 2Flats, Empak cst
TS010 N/Ph [100] 4" 400 ±15 P/P 2-7 {4.8-5.6} SEMI Prime, 2Flats, Empak cst, TTV<5μm
C925 N/Ph [100] 4" 500 ±10 P/P 2--5 SEMI TEST (wafers have spots resembling water splashes, which do not come off), 2Flats, in hard cassettes of 4, 5 & 5 wafers
6001 N/Ph [100] 4" 400 ±10 P/P 1--10 SEMI Prime, 2Flats, Empak cst, TTV<5μm
5903 N/Ph [100] 4" 400 P/E 1--6 SEMI Prime, 2Flats, Empak cst
S5763 N/Ph [100] ±1° 4" 465 ±10 E/E 1--3 SEMI, 1Flat, Empak cst
6497 N/Ph [100-25° towards[110]] ±0.5° 4" 500 P/P 1-100 SEMI Prime, 2Flats, Empak cst, TTV<5μm
E153 N/Ph [100] 4" 2,500 P/P 1-100 SEMI Prime, 2Flats, Individual cst, Group of 3 wafers
6134 N/Ph [100] 4" 275 P/P 0.10-0.15 SEMI Test, 2Flats, Empak cst, Not sealed both sides scratched
7017 N/Sb [100] 4" 450 P/E ~0.03 SEMI Prime, 1Flat, Empak cst, Cassettes of 1 + 3 wafers
H304 N/Sb [100] 4" 525 P/E 0.020-0.022 Prime, 2Flats, Empak cst
B905 N/Sb [100] 4" 310 ±15 P/P 0.010-0.025 SEMI Test, 2Flats, TTV<5μm, Light defects on back side, Empak cst
TS028 N/Sb [100-2.5°] ±0.5° 4" 500 ±10 P/P 0.01-0.02 {0.0144-0.0148} SEMI Prime, 2Flats, Empak cst, TTV<5μm
F138 N/Sb [100] 4" 525 P/E 0.01-0.02 SEMI Prime, 2Flats, Empak cst
F219 N/As [100] 4" 525 P/E 0.001-0.005 SEMI Test (Chipped edge), 2Flats, Empak cst
F562 N/As [100] 4" 525 PlyAP/E 0.001-0.005 With layer of Al2O3, ~0.1μm or ~0.05μm thick, Wafers with a matrix of Polycrystalline Silicon dots, Empak cst,
6986 N/Sb [100] 4" 1,500 P/E 0.001-0.030 SEMI Prime, 2Flats, Empak cst
4975 N/Sb [211] ±0.5° 4" 1,500 ±15 P/P 0.01-0.02 SEMI Prime, 1Flat, Empak cst, TTV<1μm
F975 N/Sb [211] ±0.5° 4" 1,600 C/C 0.01-0.02 SEMI Test, 1Flat, Empak cst, Wafers can be polished for additional fee
6688 N/Ph [111-4°] 4" 525 P/E 3--5 SEMI Prime, 1Flat, Empak cst
6715 N/Ph [111] 4" 2,500 P/P 2.0-2.5 SEMI Prime, 2Flats, Individual cst (group of 3 wafers)
5637 N/Ph [111] ±0.5° 4" 750 P/P 1-100 SEMI Prime, 2Flats, Empak cst, TTV<5μm
F677 N/Ph [111] ±0.5° 4" 1,000 P/E 1--10 SEMI Prime, 2Flats, Empak cst
S5810 N/Ph [111] ±1.0° 4" 525 P/E 0.3-50.0 SEMI Prime, 2Flats, Empak cst
TS078 N/Sb [111-4°] ±0.5° 4" 457 P/E 0.02-0.05 {0.0204-0.0342} SEMI Prime, 2Flats, Empak cst
6433 N/Sb [111-0.5° towards[-1,-1,2]] ±0.1° 4" 525 P/E 0.01-0.02 SEMI Prime, 2Flats, Empak cst
TS119 N/Sb [111-4°] ±0.5° 4" 381 P/E 0.008-0.020 {0.0108-0.0141} SEMI Prime, 2Flats, HBSD, Cassettes of 7 + 3 wafers
TS111 N/Sb [111-3.5°] ±1° 4" 315 ±15 P/E 0.005-0.020 {0.016-0.019} SEMI Prime, 2Flats, Empak cst
B786 N/Sb [111-4.0°] ±0.5° 4" 475 ±15 P/E 0.005-0.020 {0.0113-0.0156} SEMI Prime, 2Flats, Empak cst
TS015 N/Sb [111-1.5°] ±0.15° 4" 525 P/EOx 0.005-0.018 {0.0129-0.0161} SEMI Prime, 2Flats, Back-side LTO 400nm, Empak cst
D741 N/As [111-4°] ±0.5° 4" 300 P/E 0.001-0.005 SEMI Prime, 2Flats, Back-side Sand-blasted with LTO seal, in Empak cassettes of 7 wafers
TS080 N/As [111-1.5°] ±0.15° 4" 525 P/EOx 0.001-0.002 {0.00165-0.00198} SEMI Prime, 2Flats, Back-side LTO 400nm, Empak cst
J656 N/As [111-4°] 4" 525 P/E 0.001-0.005 SEMI Prime, 2Flats, Empak cst
TS051 N/As [111-4°] ±1° 4" 889 ±15 P/EOx 0.001-0.005 {0.0031-0.0033} SEMI Prime, 2Flats, Back-side: LTO 500nm, Empak cst

 

76.2mm Silicon Wafers Partial Cassette

6510 P/B [100] 3" 350 P/P FZ 1-5 SEMI Prime, 2Flats, Empak cst, Lifetime >1,500μs
S5610 P/B [100] 3" 890 ±13 P/P FZ 0.5-10.0 SEMI, Empak cst, TTV<8μm
L978 P/B [111] ±0.5° 3" 380 P/E FZ 8,000-10,000 SEMI TEST (has scratches), 1Flat, in hard cst
M942 P/B [111] ±0.5° 3" 475 P/E FZ >4,400 SEMI Prime, 1Flat, Empak cst, TTV<5μm
S5554 P/B [111] ±0.25° 3" 400 P/E FZ >100 SEMI Prime, 1Flat, Empak cst
I642 N/Ph [100] 3" 380 P/P FZ 5,000-8,000 SEMI Prime, 2Flats, Empak cst
H138 N/Ph [100] 3" 6,000 P/P FZ >5,000 Prime, NO Flats, Individual cst
C215 N/Ph [100] 3" 381 P/P FZ 100-500 SEMI Prime, 2Flats, Empak cst
F421 N/Ph [100] 3" 300 P/P FZ 45-52 SEMI Prime, 2Flats, in Empak cassettes of 3 wafers
6509 N/Ph [100] 3" 350 P/P FZ 1-5 SEMI Prime, 2Flats, MCC Lifetime>1,000μs, Empak cst
4987 N/Ph [100] 3" 300 P/P FZ 0.8-2.5 SEMI Prime, 2Flats, Empak cst, Lifetime >7,000μs
C987 N/Ph [100] 3" 300 P/E FZ 0.8-2.5 SEMI Prime, 2Flats, Empak cst, Back side originally polished but has scratches, Front is Epi-Ready
5753 N/Ph [211-5°] ±0.5° 3" 508 P/P FZ >50 Prime, 1Flat, Empak cst
5752 N/Ph [211-5°] ±0.5° 3" 508 P/P FZ 25-75 Prime, 1Flat, Empak cst
5758 N/Ph [211] ±0.5° 3" 508 P/P FZ 25-75 Prime, 1Flat, Empak cst
5754 N/Ph [211] ±0.5° 3" 1,016 P/P FZ 25-75 Prime, 1Flat, Empak cst
G116 N/Ph [111] ±0.5° 3" 415 ±15 E/E FZ 10,000-12,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,500μs
5707 N/Ph [111] ±0.5° 3" 370 P/E FZ >5,000 SEMI Prime, 1Flat
I707 N/Ph [111] ±0.5° 3" 370 P/E FZ >5,000 SEMI Test, 1Flat, Scratches on polished side
F264 N/Ph [111] ±0.5° 3" 675 P/P FZ >5,000 SEMI Prime, 1Flat, Empak cst, TTV<4μm, Lifetime>800μs
I978 N/Ph [111] ±0.5° 3" 380 P/E FZ 4,000-8,000 SEMI Prime, 1Flat, in hard cassettes of 1 & 2 wafers
K978 N/Ph [111] ±0.5° 3" 380 BROKEN FZ 4,000-8,000 Broken P/E wafer, 1Flat, Soft cst
E383 N/Ph [111] ±0.5° 3" 380 P/E FZ 3,000-5,000 SEMI Prime, 1Flat, in Empak, Lifetime>1,000μs,
X180 Intrinsic Si:- [100] 3" 350 P/E FZ >20,000 SEMI Prime, 1Flat, Empak cst
K834 Intrinsic Si:- [100] 3" 380 P/E FZ >20,000 SEMI Test, 1Flat, Empak cst, unpolished side has stain
S212 Intrinsic Si:- [100] 3" 500 P/P FZ >20,000 SEMI Prime, 1Flat, Empak cst, Front Side Prime, back side Test
6101 Intrinsic Si:- [100] 3" 4,000 P/P FZ >8,000 Test, Scratched, 1Flat, Individual cst
K593 Intrinsic Si:- [111] ±0.5° 3" 380 P/P FZ >20,000 SEMI Prime, 1Flat, Empak cst, Lifetime>1,460μs, also includes 2 extra scratched wafers at no charge (10 total in cassette)
D809 Intrinsic Si:- [111] ±0.5° 3" 380 P/E FZ >20,000 SEMI Prime, 1Flat, Empak cst
7185 Intrinsic Si:- [111] ±0.5° 3" 1,975 P/P FZ >20,000 Prime, 1Flat, Individual cst
D048 Intrinsic Si:- [111] ±0.5° 3" 1,975 P/P FZ >20,000 Test, NO Flats, Individual cst, Scratches on both sides
L730 Intrinsic Si:- [111] ±0.5° 3" 350 P/P FZ >15,000 SEMI Prime, 1Flat, Empak cst, TTV<5μm
I667 P/B [110] ±0.5° 3" 380 P/E >100 SEMI Prime, Primary Flat @ [111], Secondary @ [111] 70.5° from Primary, in hard cassettes of 1, 2 & 2 wafers
4154 P/B [110] ±0.5° 3" 360 P/P 1--10 SEMI Prime, 2Flats, TTV<1μm, 1-2 weeks ARO o repolish
H173 P/B [110] ±0.5° 3" 381 P/E 0.085-0.115 SEMI Prime, Primary Flat @ [111]±0.5°, Secondary @ [111] 109.5° CW from Primary, in Epak cassettes of 6, 7 & 7 wafers
G714 P/B [110] ±0.3° 3" 381 P/E 0.0448-0.0672 SEMI Prime, 2Flats, Primary @ [111], Secondary @ [111] 109.5±2° CW from Primary, in hard cassettes of 5 wafers
6183 P/B [100] 3" 500 P/E 10--20 SEMI Prime, 1Flat, Empak cst
6515 P/B [100] 3" 250 P/P 1--20 SEMI Prime, Empak cst, TTV<5μm
6325 P/B [100] 3" 380 P/E 1--10 SEMI Prime, 2Flats, Empak cst
S5865 P/B [100-6° towards[110]] ±0.5° 3" 381 P/E 1--10 SEMI Prime, 2Flats, Empak cst
6826 P/B [100] 3" 475 P/P 1--50 SEMI Prime, 2Flats, Empak cst, TTV<0.3μm
K056 P/B [100] 3" 5,000 P/E 1--20 Prime, NO Flats, Individual cst
4394 P/B [100] 3" 300 P/P 0.5-10.0 SEMI Prime, 1Flat, TTV<2μm, Empak cst
S5853 P/B [100] 3" 315 P/P 0.5-10.0 SEMI Prime, 1Flat, Empak cst, TTV<3μm
T206 P/B [100] 3" 3,050 ±50 C/C >0.5 1Flat, Individual cst (can be ordered singly)
3014 P/B [100] 3" 250 P/E 0.15-0.20 SEMI TEST (Scratches), 2Flats, in sealed Empak cassettes of 3 wafers
J014 P/B [100] 3" 250 BROKEN 0.15-0.20 Broken wafers, in Epak cst
H558 P/B [100] 3" 356 P/P 0.015-0.020 SEMI, 2Flats, Empak cst
2248 P/B [100] 3" 300 P/E 0.01-0.02 SEMI Prime, 2Flats, Empak cst
G989 P/B [100] 3" 380 P/P 0.01-0.02 SEMI Prime, 2Flats, Empak cst
7140 P/B [100] 3" 380 P/E 0.01-0.02 SEMI Prime, 2Flats, Empak cst
6701 P/B [100] 3" 100 P/P 0.0026-0.0030 SEMI Prime, 2Flats, Empak cst
7056 P/B [100] 3" 100 P/P 0.0026-0.0030 SEMI Prime, 2Flats, Empak cst
TS129 P/B [100] 3" 381 P/E 0.002-0.005 {0.0032-0.0041} SEMI Prime, 2Flats, TTV<5μm, Empak cst
TS130 P/B [100] 3" 381 P/E 0.002-0.005 {0.0037-0.0039} SEMI Prime, 2Flats, TTV<7μm, Empak cst
D750 P/B [100] 3" 420 P/P <1 SEMI Prime, 2Flats, Empak cst, TTV<1μm
3366 P/B [5,5,12] ±0.5° 3" 380 P/E 1--10 SEMI Prime, 1Flat, Empak cst
D331 P/B [211] ±0.5° 3" 525 P/E >10 SEMI Prime, 1Flat, Empak cst
6944 P/B [111] ±0.5° 3" 2,000 P/P 8--9 SEMI Prime, 2Flats, Indivdual cst, Groups of 2 + 3 wafers
6949 P/B [111] 3" 2,300 P/P 4--7 SEMI Prime, 1Flat, Individual cst
TS052 P/B [111] ±1° 3" 400 ±19 P/E 0.0436-0.0590 {0.0437-0.0446} SEMI Prime, 1Flat, Empak cst, TTV<3μm
H120 P/B [111-4°] ±0.5° 3" 381 P/EOx 0.01-0.02 {0.0145-0.0148} SEMI Prime, 1Flat, Empak cst
6464 P/B [111-4.0° towards[112]] ±0.5° 3" 406 P/E 0.005-0.015 SEMI Prime, 1Flat, Empak cst
7157 P/B [111] ±0.5° 3" 600 P/P 0.005-0.020 SEMI Prime, 1Flat, Empak cst
6722 P/B [111-3.5°] 3" 300 P/E 0.004-0.005 SEMI Prime, 1Flat, Empak cst, TTV<5μm
TS042 P/B [111-3°] ±0.5° 3" 381 P/E 0.004-0.008 {0.0049-0.0058} SEMI Prime, 1Flat, Free of Striations, Empak cst
F092 N/Ph [110] ±0.5° 3" 381 P/E 11--15 SEMI Prime, 2Flats, Individual cst, TTV<15μm
C720 N/Ph [110] ±0.5° 3" 381 P/E 1--10 SEMI Prime, SEMI Flat (one) @ [1,-1,0], in Empak cassettes of 7 wafers
S5580 N/Ph [100] ±1° 3" 2,286 ±13 P/P 15-28 SEMI Prime, 1Flat, TTV<1μm, Sealed in individual csts, in groups of 5 wafers
C384 N/Ph [100] 3" 300 P/P 10--30 SEMI Prime, 2Flats, Empak cst
6366 N/Ph [100] 3" 1,500 P/E 5--7 SEMI Prime, 2Flats, Empak cst
6711 N/Ph [100] 3" 250 P/P 2--20 SEMI Prime, 2Flats, Empak cst, TTV<5μm
6026 N/Ph [100] 3" 350 P/P 1--5 SEMI Prime, 2Flats, Empak cst
6400 N/Ph [100] 3" 350 P/P 1--25 SEMI Prime, 1Flat, TTV<1μm, Empak cst
6818 N/Ph [100] 3" 381 P/P 1--30 SEMI Prime, 2Flats, Empak cst, TTV<1μm
N150 N/Ph [100] 3" 381 P/P 1--5 SEMI Prime, 1Flat, Empak cst, TTV<5μm, Bow/Warp<10μm
S5856 N/Ph [100-4°] ±0.5° 3" 500 P/E 1--20 Prime, 2Flats, Empak cst
6308 N/Ph [100] 3" 6,000 P/E 1--20 SEMI Prime, 1Flat, Individual cst< In sealed group of 8 wafers
J763 N/Sb [100] 3" 300 P/E 0.02-0.04 SEMI Prime, 2Flats, in hard cassettes of 2 wafers
TS079 N/As [100] 3" 889 P/EOx 0.001-0.005 {0.0028-0.0037} SEMI Prime, 2Flats, Back-side: LTO 500nm thick, Empak cst
1263 N/Ph [111] ±0.5° 3" 1,400 P/E 25-35 SEMI Prime, 1Flat, in single wafer cassettes, sealed in groups of 5
H136 N/Ph [111] 3" 10,000 P/E 20-60 SEMI Prime, 1Flat, Individual cst
6198 N/Ph [111] 3" 3,000 P/E 10--20 SEMI Prime, 2Flats, Individual cst, Groups of 2 + 3 wafers
S5552 N/Ph [111] ±0.5° 3" 380 P/E 1--10 SEMI Prime, Empak cst
S5842 N/Ph [111] ±0.5° 3" 570 P/P 1--10 SEMI Prime, Empak cst
F136 N/Ph [111] ±0.5° 3" 1,000 P/P 0.5-2.0 SEMI Prime, 2Flats, Empak cst
2256 N/Sb [111] ±0.5° 3" 380 P/E 0.019-0.026 SEMI Prime, 2Flats, in Empak cassettes of 5 wafers
TS070 N/Sb [111-2.5°] ±0.5° 3" 381 P/E 0.005-0.016 SEMI Prime, 1Flat, Empak cst, TTV<5μm
6431 N/As [111] ±0.5° 3" 320 P/P 0.001-0.005 SEMI Prime, 2Flats, Empak cst, TTV<5μm
E380 N/As [111-4°] ±0.5° 3" 380 P/E 0.001-0.005 SEMI Prime, 2Flats, Empak cst
S5858 N/As [112-3° towards[111]] ±0.5° 3" 890 P/E 0.002-0.003 Prime, 2Flats, Empak cst
D158 N/As [225] 3" 300 P/E 0.001-0.003 SEMI Prime, 1Flat, Empak cst

 

50.8mm Silicon Wafers Partial Cassette

5580 P/B [110] ±0.5° 2" 279 P/E FZ >1,000 2Flats, hard cst
D769 P/B [111] ±0.5° 2" 500 P/P FZ 5,000-6,500 SEMI Test (in unsealed cassette), 1Flat
L609 P/B [111] ±0.5° 2" 275 P/E FZ 3,000-5,000 SEMI Prime, 1Flat, Lifetime>2,000μs, in hard cassettes of 5 wafers
J688 P/B [111-7° towards[110]] ±0.5° 2" 279 P/P FZ >2,000 SEMI Prime, 1Flat, hard cst
F783 P/B [111] ±0.5° 2" 331 P/E FZ 2,000-5,000 SEMI TEST (Scratched), Soft cst
G783 P/B [111] ±0.5° 2" 331 P/E FZ 2,000-5,000 SEMI Prime, in Soft cassettes of 4 wafers
B027 P/B [111] 2" 381 P/E FZ 2,000-5,000 SEMI TEST (Wafers scratched and cannot be recleaned), hard cst
E542 P/B [111] ±0.5° 2" 275 P/P FZ 1-10 SEMI Prime, 1Flat, hard cst
C049 N/Ph [110] ±1° 2" 525 P/E FZ 5,000-10,000 SEMI Prime, Lifetime>1,000μs, Primary Flat @ [111]±0.5°, Secondary @ [111] 70.5° CW from Primary
C713 N/Ph [110] ±0.5° 2" 400 P/E FZ 4,000-20,000 SEMI, 1Flat, hard cst, Lifetime>1,000μs
2894 N/Ph [110] 2" 900 P/E FZ 130-350 SEMI Prime, 1Flat, hard cst
4032 N/Ph [110] ±0.5° 2" 900 P/E FZ 50-100 SEMI Prime, hard cst, Primary Flat only at [111]±0.5°
B973 N/Ph [100] 2" 225 P/P FZ >100 SEMI, 2Flats, Individual cst, 1 very deep scratch
E780 N/Ph [111] ±0.5° 2" 280 P/P FZ 2,000-4,000 SEMI Prime, 1Flat, hard cst, TTV<5μm
7264 N/Sb [111-2° towards[110]] 2" 280 P/E FZ 0.008-0.015 Prime, 1Flat, hard cst
G240 Intrinsic Si:- [100] 2" 280 P/E FZ >20,000 SEMI Prime, 1Flat, hard cst, Lifetime>1,000μs; 5 Prime wafers, 8 wafers with up to 2 scratches each
J727 Intrinsic Si:- [100] 2" 280 P/E FZ >20,000 SEMI Prime, 1Flat, hard cst
6164 Intrinsic Si:- [100] 2" 500 ±10 P/E FZ >10,000 SEMI Prime, 1Flat, hard cst
3509 Intrinsic Si:- [100] 2" 300 P/E FZ 5,000-10,000 SEMI Prime, 1Flat, hard cst
E509 Intrinsic Si:- [100] 2" 300 P/E FZ 5,000-10,000 SEMI Prime, 1Flat, in hard cassettes of 2 & 5 wafers
K324 Intrinsic Si:- [111] ±0.5° 2" 330 P/P FZ >20,000 SEMI, 1Flat, hard cst
C118 P/B [100] 2" 300 P/E 5--10 SEMI, 1Flat, in hard cassettes of 1, 2, 3 & 3 wafers
5097 P/B [100] 2" 250 P/P 1--5 SEMI Prime, 1Flat, hard cst
F708 P/B [100] 40mm 250 P/E 1-100 SEMI Prime, 1Flat, Soft cst
N610 P/B [100] 2" 280 P/P 0.4-0.6 SEMI Prime, 2Flats, hard cst
H995 P/B [100] 2" 300 P/E 0.016-0.017 Prime, NO Flats, hard cst
M163 P/B [100] 2" 250 P/P 0.015-0.020 SEMI Prime, 1Flat, hard cst
T154 P/B [100] 2" 250 P/P 0.015-0.020 SEMI Prime, 1Flat, hard cst
5918 P/B [100] 2" 3,000 P/E 0.015-0.020 Groups of 5 + 5 + 6 wafers, Test, 2Flats, Individual cst, Wafers with defects
D570 P/B [100] 2" 250 P/P 0.01-0.02 SEMI Prime, 1Flat, hard cst, TTV<5μm
6077 P/B [100] 2" 500 P/P 0.01-0.02 SEMI Prime, 2Flats, hard cst
B833 P/B [100] 2" 300 P/E 0.001-0.005 SEMI Prime, 2Flats, hard cst
H607 P/B [100] 2" 525 P/P <0.01 {0.0076-0.0078} SEMI Prime, 2Flats, in hard cassettes of 5 wafers.
K988 P/B [111] 2" 300 P/P 3--16 SEMI Prime, 1Flat, hard cst
6107 P/B [111] ±0.5° 2" 275 P/E 1--30 SEMI Prime, 1Flat, hard cst
C702 P/B [111] ±0.5° 2" 425 P/P 1-4 {2.8-3.1} SEMI Test, 1Flat, hard cst, Dirty, can be recleaned and polished for additional fee
J096 P/B [111-10° towards[112]] 2" 280 P/E 0.5-0.6 SEMI Prime, 1Flat, hard cst
L445 P/B [111] ±0.5° 2" 275 P/P 0.1-0.3 SEMI Prime, 1Flat, hard cst
I096 P/B [111] ±0.5° 2" 280 P/E 0.1-1.0 SEMI Prime, 1Flat, hard cst
J445 P/B [111] ±0.5° 2" 500 P/P 0.1-0.3 SEMI Prime, 1Flat, hard cst
4820 P/B [111] 2" 1,000 P/E 0.001-0.005 SEMI Prime, 1Flat, hard cst
5533 P/B [111] ±0.5° 2" 500 P/P <0.01 SEMI Prime, 1Flat, hard cst
5596 P/B [111] ±0.5° 2" 500 P/P <0.01 {0.00087-0.00100} SEMI Prime, 1Flat, hard cst
6031 N/Ph [110] 2" 280 P/E 19-33 SEMI Prime, 1 Flat @ [1,-1,0], in hard cst
P763 N/Sb [110] 2" 375 P/E 0.005-0.020 SEMI, 1Flat, hard cst
R243 N/Ph [100] 2" 400 P/P 210-880 SEMI Prime, 2Flats, hard cst
C878 N/Ph [100] 2" 300 P/P 10--30 SEMI Prime, 1Flat, hard cst
7087 N/Ph [100] 2" 220 ±10 P/P 5--20 Prime, 2Flats, 2nd 180°, hard cst
3034 N/Ph [100] 2" 500 P/P 5--10 SEMI Prime, 2Flats, hard cst
6769 N/Ph [100] 2" 5,000 P/E 3.4-3.7 SEMI Prime, 2Flats, Individual cst, Groups of 2 wafers
C864 N/Ph [100] 2" 200±30μm P/P 1.25-2.50 SEMI Prime, 1Flat, hard cst
G629 N/Ph [100] 2" 350 P/P 1--50 Test, Polished but dirty and scratched. Can be re-polished for additional fee, NO Flats, hard cst
S5566 N/Ph [100] ±1° 2" 400 ±15 P/P 1--10 SEMI Prime, 1Flat, TTV<3μm, Empak cst
6563 N/Ph [100] 2" 3,175 P/E 1--3 Prime, NO Flats, Individual cst
4333 N/Ph [100] ±1.0° 2" 6,000 P/E 1--10 SEMI Prime, 2Flats, Individual cst
F857 N/Ph [100] 2" 300 P/P 0.8-1.0 SEMI Prime, 2Flats, hard cst
D576 N/Sb [100] 2" 500 P/P 0.01-0.02 SEMI Prime, 2Flats, in hard cassettes of 5 wafers
4501 N/As [100] 2" 7,050 P/E 0.0031-0.0038 SEMI Prime, 2Flats, Individual cst Group of 2 wafers
6931 N/As [100] 2" 300 P/E 0.001-0.006 SEMI Prime, 2Flats, hard cst
2039 N/As [100] 2" 420 ±15 P/P 0.001-0.005 {0.0030-0.0034} SEMI Prime, 2Flats, Empak cst
4765 N/Ph [111] ±0.5° 2" 5,000 P/E >20 Prime, NO Flats, Individual cst, Group of 2 wafers
5238 N/Ph [111] 2" 5,000 P/E 15-20 SEMI Prime, 1Flat, Individual cst, (group of 6 wafers)
2901 N/Ph [111] ±0.5° 2" 500 P/E 10--12 SEMI Prime, 2Flats, hard cst
2995 N/Ph [111-3°] ±0.5° 2" 600 P/E ~10 SEMI Prime, 1Flat, TTV<3μm, hard cst
S5855 N/Ph [111] ±0.5° 2" 500 P/P 2.8-10.0 SEMI Prime, hard cst
F384 N/Ph [111] 2" 275 P/P 2.5-3.5 SEMI Prime, 2Flats, hard cst
N763 N/Ph [111] 2" 500 P/E 2.2-3.8 SEMI Prime, 2Flats, hard cst
G136 N/Ph [111] 2" 275 P/P 1.48-1.70 Prime, 1Flat, hard cst
G031 N/Ph [111] 2" 500 P/E 1--10 SEMI Prime, 2Flats, hard cst
4878 N/Ph [111] ±0.5° 2" 6,000 P/E 1--10 SEMI Prime, 1Flat, Individual cst
Q962 N/Sb [111-3.5°] ±0.5° 2" 300 P/E 0.05-0.09 SEMI Prime, 2Flats, in hard cassettes of 5 & 8 wafers
4958 N/Sb [111] 2" 2,900 P/P 0.013-0.015 Prime, NO Flats, Individual cst, Group of 5 wafers

 

25.4mm Silicon Wafers Partial Cassette

D975 N/Ph [100] 1" 475 ±10 E/E FZ >500 {1,900-2,400} NO Flats, Soft cst
6446 Intrinsic Si:- [100] 0.5" 12,700 C/C FZ >10,000 NO Flats, a set of 4 rods sealed in polyehtylene foil
1978 Intrinsic Si:- [111] ±0.5° 1" 1,000 P/E FZ 14,000-30,000 NO Flats, Soft cst, Cassettes of 7, 6, 6 wafers
4427 Intrinsic Si:- [111] ±2° 1" 27,870 C/C FZ >10,000 Single Crystal Silicon Rod, 0.39" diameter × 27.87±0.1mm
7043 P/B [100] 1" 800 P/E 8--12 SEMI Prime, 1Flat, Soft cst
6567 P/B [100] 1" 300 P/P 4--6 SEMI Prime, 1Flat, Soft cst
6166 P/B [100] 1" 525 ±10 P/E 1--30 Prime, NO Flats, Soft cst, TTV<5μm
L678 P/B [100] 1" 3,000 P/E 1--50 Prime, NO Flats, Individual cst, Group of 13 wafers
6879 P/B [100] 1" 275 P/E 0.0022-0.0025 Prime, NO Flats, Soft cst
G704 P/B [111] ±0.5° 1" 50 ±10 P/P 1-100 NO Flats, Soft cst
K729 N/Ph [100] 1" 50 ±10 P/P >20 SEMI Prime, 1Flat, TTV<5μm, in single wafer trays between clean-room sheets, MOQ 4 wafers
6179 N/Ph [100] 1" 1,500 P/E 1--20 Prime, NO Flats, Soft cst