We have a large selection of 12 inch silicon wafers. We have all the grades including:
We have access to a large selection of 300mm wafer of various specs, grades and quantity.
Please sed us the specs you would like us to quote you!
Growth Method: CZ
Notch Orientation: <110>+/-1°
Lead-time: Immediate Shipment ARO
COA available with each shipment
300mm wafers are often reffered to 12 inches. In fact the exact conversion is 11.811023622 inches!
We can sell as few as one 300mm silicon wafer. Please fill out the form and let us know what specs and quantity we can quote for you.
Compared to other silicon wafer suppliers, UniversityWafer, Inc's silicon wafer prices are arguably the best found online.
300mm silicon wafers have a higher yield per wafer than pervious large diameter silicon wafers. Thus increasing the amount of wafer chips that can be produced on one wafer die. The next diameter on the market are 450mm.
Our 300mm silicon wafers properties include n-type and p-type and undoped. Our 300mm silicon wafer orientation include (100) and (111).
UniversityWafer, Inc's silicon wafer manufacturing process can 300mm silicon wafers to very thin thicknesses both single and double side polished for all your wafer electronics research.
Please send us the specs and quantity you would like us to quote.
We have a large supply of undoped 12 inch silicon.
300mm >750ohm/cm 775+/-25um, DSP, Undoped, FZ
Pleas let us know if you can use or if you need another spec?
Researcher asked the following:
We would like to backgrind/polish 12" wafers from the regular thickness (750um) down to about 300um. Our current backside roughness requirement is Ra=9nm, Rz=65nm. This is equivalent to Polygrind. It would be a plus, but not a requirement to achieve similar roughness. Is that a service that you provide? If so, please quote for 2, 10 and 25 wafer batches. If you do not provide this service, do you happen to know who might provide this?
UniversityWafer, Inc replied:
This would be equivalent to our #4000 grit which is 100 Angstroms or 10nm. This leaves the finest of grind marks that cannily be seen under high-intensity light.
Very good. That was quick! We would supply the wafers. What method is used to ship wafers back: as they are thinned, they will be more fragile.
Maybe this is what the return horizontal jar is about?
Do you have experience shipping thinned down wafers to that thickness?
Yes, that container lays the wafer flat, separated by tyvek paper and cushioned in closed cell foam. We’ve shipped back 300mm wafers as thin as 100um using this method with no issues.
12" 300+/-10um Ra <9nm Rz <65nm Grinding/Polish