Item |
Type/dop |
Orient. |
Diam. |
Thck (μm) |
Pol |
Resistivity Ohm-cm |
TS006 |
P/B |
[100] |
6" |
525 ±15 |
P/E |
MCZ 0.01--0.02 {0.015--0.017} |
SEMI Prime, 1 SEMI Flat 57.5mm @ <011>±0.5°, Non--standard Edge profile, Oxygen=(11--13)ppma, Carbon<1ppma, Empak cst |
TS004 |
P/B |
[100] |
6" |
675 ±15 |
P/E |
MCZ 0.01--0.02 {0.013--0.017} |
SEMI Prime, 1 SEMI Flat 57.5mm @ <011>±0.5°, Oxygen=(3--9)ppma, Carbon<1ppma, Back--side: Acid etch, Empak cst |
TS005 |
P/B |
[100] |
6" |
675 ±15 |
P/E |
MCZ 0.01--0.02 {0.013--0.016} |
SEMI Prime, 1Flat 57.5mm @ <001>±0.5° {not @ <011>}, Oxygen=(3--9)ppma, Carbon<1ppma, Back--side: Acid etch, Empak cst |
K667 |
P/B |
[100] |
6" |
900 |
C/C |
FZ >1,000 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
7038 |
P/B |
[111] ±0.5° |
6" |
875 |
P/E |
FZ >10,000 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
6898 |
P/B |
[111] ±0.5° |
6" |
1,000 |
P/E |
FZ >5,000 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
7208 |
N/Ph |
[100] ±1° |
6" |
1,000 ±50 |
P/P |
FZ >9,500 |
SEMI Prime, 1Flat (57.5mm), Empak cst, Lifetime>6,000μs |
E239 |
N/Ph |
[100] |
6" |
825 |
C/C |
FZ 7,000--8,000 {7,025--7,856} |
SEMI, 1Flat, Lifetime=7,562μs, in Open Empak cst |
F907 |
N/Ph |
[100] |
6" |
3,000 |
P/P |
FZ >4,800 |
SEMI Prime, 1Flat (57.5mm), Individual cst, Lifetime>7,000μs. |
7212 |
N/Ph |
[100] ±1° |
6" |
450 |
P/P |
FZ 4,300--8,300 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
7233 |
N/Ph |
[100] ±1° |
6" |
675 |
P/P |
FZ 4,300--8,300 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
L625 |
N/Ph |
[100--6° towards[111]] ±0.5° |
6" |
625 |
P/E |
FZ >3,500 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
E700 |
N/Ph |
[100--6° towards[111]] ±0.5° |
6" |
675 |
P/P |
FZ >3,500 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
F700 |
N/Ph |
[100--6° towards[111]] ±0.5° |
6" |
790 ±10 |
C/C |
FZ >3,500 |
SEMI, 1Flat, Empak cst |
4982 |
N/Ph |
[100--6° towards[111]] ±0.5° |
6" |
675 |
P/P |
FZ >1,000 |
SEMI Prime, Notch on <010> {not on <011>}, Laser Mark, Empak cst |
D982 |
N/Ph |
[100--6° towards[111]] ±0.5° |
6" |
675 |
BROKEN |
FZ >1,000 |
SEMI notch Broken -- one piece ~50% of wafers other pieces ~20% of wafer, Empak cst |
7122 |
N/Ph |
[100] |
6" |
500 ±10 |
P/P |
FZ 50--70 |
SEMI Prime, 1Flat, Empak cst |
G122 |
N/Ph |
[100] |
6" |
500 ±10 |
P/P |
FZ 50--70 |
SEMI Prime, 1Flat, Empak cst |
5325 |
N/Ph |
[100] |
6" |
725 |
P/P |
FZ 50--70 {57--62} |
SEMI Prime, 1Flat (57.5mm), Lifetime=15,700μs, Empak cst |
7053 |
N/Ph |
[100] |
6" |
2,000 |
P/P |
FZ 50--70 |
SEMI Prime, 1Flat (57.5mm), Cassettes of 10 + 6 wafers |
6883 |
N/Ph |
[100] |
6" |
625 ±5 |
P/P |
FZ 40--90 |
SEMI Prime, 1Flat (57.5mm), Total Thickness Variation TTV <3μm,, Empak cst |
G883 |
N/Ph |
[100] |
6" |
650 ±5 |
P/P |
FZ 40--90 |
SEMI Prime, 1Flat (57.5mm), TTV<3μm,, Empak cst |
F883 |
N/Ph |
[100] |
6" |
675 ±5 |
P/P |
FZ 40--90 |
SEMI Prime, 1Flat (57.5mm), TTV<3μm,, Empak cst |
S5622 |
N/Ph |
[100] |
6" |
1,300 ±10 |
E/E |
FZ 0.01--0.05 |
SEMI notch, Empak cst |
G228 |
N/Ph |
[111] ±0.5° |
6" |
300 ±15 |
BROKEN |
FZ >6,000 |
Test,Broken into a dozen large pieces ranging from 65% of wafer to 5% and small pieces as well |
N445 |
N/Ph |
[112--5.0° towards[11--1]] ±0.5° |
6" |
875 ±10 |
E/E |
FZ >3,000 |
SEMI, 1Flat (47.5mm), TTV<4μm, Surface Chips |
G343 |
N/Ph |
[112--5° towards[11--1]] ±0.5° |
6" |
1,000 ±10 |
C/C |
FZ >3,000 |
SEMI, 1 JEIDA Flat (47.5mm), Empak cst, TTV<4μm, Lifetime>1,000μs |
7116 |
Intrinsic Si:- |
[100] |
6" |
675 |
P/P |
FZ >65,000 |
SEMI notch Prime, Empak cst |
M526 |
Intrinsic Si:- |
[100] ±0.1° |
6" |
720 ±10 |
P/P |
FZ >10,000 |
SEMI Prime, 1Flat (57.5mm), TTV<3μm, Empak cst |
7117 |
Intrinsic Si:- |
[111] ±0.5° |
6" |
875 |
P/P |
FZ >10,000 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
F613 |
P/B |
[110] ±0.5° |
6" |
300 |
P/P |
20--25 |
SEMI TEST -- scratched, can be repolished & thinned for extra fee, 2Flats, in unsealed Empak cst |
G458 |
P/B |
[110] ±0.5° |
6" |
390 ±10 |
C/C |
>10 |
2Flats, Empak cst |
TS002 |
P/B |
[110] ±0.25° |
6" |
625 ±15 |
P/E |
10--20 {11--15} |
SEMI Prime, 1 JEIDA Flat (47.5mm) @ <111>, TTV<3μm, Bow<5μm, Warp<10μm, hard cst |
TS007 |
P/B |
[110] ±0.25° |
6" |
625 ±15 |
P/E |
10--20 {13.6--13.9} |
SEMI Prime, 1 JEIDA Flat 47.5mm @ <111>±0.5°, LaserMark, TTV<2μm, Warp<10μm, Empak cst |
TS072 |
P/B |
[110] ±0.25° |
6" |
625 ±15 |
P/E |
10--20 |
SEMI Prime, 1 JEIDA Flat (47.5mm) @ <111>±0.5°, Laser Mark, TTV<3μm, Bow<5μm, Warp<10μm, Empak cst |
6427 |
P/B |
[110] ±0.5° |
6" |
675 |
P/E |
0.01--0.02 |
Prime, PFlat @ [111]±0.25°, SF @ [111]±5° 109.5° CW from PF, Empak cst |
TS054 |
P/B |
[100] |
6" |
675 |
P/E |
15--25 {16.1--21.7} |
SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5μm |
4980 |
P/B |
[100] |
6" |
220 |
P/P |
10--30 |
SEMI 1Flat (57.5mm), TEST grade (surface scratches & digs), TTV<4μm, Unsealed in Empak cst |
L405 |
P/B |
[100] |
6" |
1,000 |
P/P |
10--15 |
SEMI Prime, 1Flat (57.5mm), Empak cst, 4 Prime wafers plus 2 scratched wafers at no cost |
7066 |
P/B |
[100] |
6" |
675 |
P/P |
5--10 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
6287 |
P/B |
[100] |
6" |
675 |
P/E |
5--10 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
6751 |
P/B |
[100] |
6" |
1,000 |
P/E |
5--10 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
7030 |
P/B |
[100] |
6" |
1,000 |
P/E |
5--10 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
E964 |
P/B |
[100] |
6" |
475 |
P/P |
1--30 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
5964 |
P/B |
[100] |
6" |
500 |
P/P |
1--30 |
SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5μm |
D964 |
P/B |
[100] |
6" |
500 |
P/P |
1--30 |
SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<5μm |
5354 |
P/B |
[100--9.7° towards[001]] ±0.1° |
6" |
525 |
P/P |
1--100 |
SEMI Prime, 1Flat (57.5mm) at <110>±0.1°, Empak cst |
B420 |
P/B |
[100] |
6" |
675 |
P/P |
1--5 |
SEMI Prime, 1Flat, Soft cst |
6358 |
P/B |
[100--6° towards[111]] ±0.5° |
6" |
675 |
P/E |
1--30 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
N698 |
P/B |
[100] |
6" |
675 |
P/E |
1--100 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
6404 |
P/B |
[100] |
6" |
800 |
E/E |
1--50 |
SEMI, 1Flat (57.5mm), Empak cst, TTV<5μm |
F162 |
P/B |
[100] |
6" |
2,000 ±50 |
P/P |
1--35 |
SEMI Prime, 1Flat (57.5mm), Individual cst, Group of 6 wafers |
E162 |
P/B |
[100] |
6" |
2,000 ±50 |
P/E |
1--35 |
SEMI Prime, 1Flat (57.5mm), Group of 2 wafers, Back--Side polished with small scratches |
7047 |
P/B |
[100] |
6" |
400 |
P/P |
0.5--1.0 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
S5821 |
P/B |
[100] |
6" |
275 |
P/P |
0.01--0.05 |
SEMI Prime, 1Flat (57.5mm), TTV<2μm, Empak cst |
TS104 |
P/B |
[100] |
6" |
625 ±15 |
P/EOx |
0.01--0.02 {0.0139--0.0144} |
SEMI Prime, JEIDA Flat 47.5mm, Back--side LTO (0.3--0.4)μm, TTV<6μm, Empak cst |
TS055 |
P/B |
[100] |
6" |
675 ±15 |
P/E |
0.01--0.02 {0.0102--0.0133} |
SEMI Prime, 1Flat (57.5mm), Empak cst |
TS103 |
P/B |
[100] |
6" |
525 ±15 |
P/E |
0.007--0.015 {0.0126--0.0134} |
SEMI Prime, 1Flat (57.5mm), TTV<5μm, Empak cst |
6005 |
P/B |
[100] |
6" |
320 |
P/E |
0.001--0.030 |
JEIDA Prime, Empak cst |
6484 |
P/B |
[100] |
6" |
675 |
P/E |
0.001--0.005 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
TS108 |
P/B |
[111--3°] ±0.5° |
6" |
625 ±15 |
P/E |
0.01--0.02 |
SEMI Prime, 1Flat (57.5mm), TTV<8μm, Empak cst |
J668 |
P/B |
[111] ±0.5° |
6" |
675 |
E/E |
0.010--0.025 |
SEMI, 1Flat (57.5mm), Empak cst, TTV<5μm |
TS105 |
P/B |
[111--1.5°] ±0.35° |
6" |
675 |
P/EOx |
0.001--0.002 {0.0017--0.0018} |
SEMI Prime, 1Flat (57.5mm), Back--side LTO 400±40nm, TTV<6μm, Empak cst |
5814 |
N/Ph |
[100] |
6" |
925 ±15 |
E/E |
5--35 {12.5--29.7} |
JEIDA Prime, Empak cst, TTV<5μm |
B728 |
N/Ph |
[100] |
6" |
675 |
P/E |
2.7--4.0 |
SEMI Prime, Empak cst |
TS063 |
N/Ph |
[100] |
6" |
525 |
P/E |
1--3 {1.1--1.5} |
SEMI Prime, 1Flat (57.5mm), Empak cst |
TS075 |
N/Ph |
[100] |
6" |
525 |
P/E |
1--3 {1.5--2.0} |
SEMI Prime, Flat: JEIDA 47.5mm, Oxygen=(10--14)ppma, Carbon<1ppma, Empak cst (14 + 12 wafers) |
TS076 |
N/Ph |
[100] |
6" |
525 |
P/E |
1--3 {1.1--2.3} |
SEMI Prime, Flat: JEIDA 47.5mm, Oxygen=(10--14)ppma, Carbon<1ppma, Empak cst (8+24+25 wafers) |
6971 |
N/Ph |
[100--25° towards[110]] ±1° |
6" |
675 |
P/P |
1--100 |
SEMI notch Prime, Empak cst, TTV<1μm |
6965 |
N/Ph |
[100] |
6" |
675 ±10 |
P/E |
1--10 {4.34--5.36} |
SEMI Prime, 1Flat (57.5mm), Empak cst |
7170 |
N/Ph |
[100] ±1° |
6" |
675 |
P/E |
1--20 {1.8--12.0} |
Prime, 2 SEMI Flats, Back--side Acid etched, Empak cst |
C716 |
N/Ph |
[100--28° towards[110]] ±1° |
6" |
700 |
P/P |
1--100 |
SEMI Notch Prime, TTV<2μm, Empak cst |
S5913 |
N/Ph |
[100] ±1° |
6" |
800 |
P/E |
1--10 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
F859 |
N/Ph |
[100--25° towards[110]] ±1° |
6" |
800 |
C/C |
1--100 |
SEMI notch Prime, Empak cst |
E089 |
N/Ph |
[100] |
6" |
1,910 ±10 |
P/P |
1--100 |
SEMI Prime, 1Flat (57.5mm), TTV<2μm, in stacked trays of 2 wafers |
F089 |
N/Ph |
[100] |
6" |
1,910 ±10 |
P/P |
1--100 |
SEMI Prime, 1Flat (57.5mm), TTV<5μm, sealed in stacked trays of 1 + 3 wafer |
G844 |
N/Ph |
[100] |
6" |
5,000 |
P/P |
1--35 |
SEMI Prime, 1Flat (57.5mm), Individual cst |
L066 |
N/Sb |
[100] |
6" |
675 |
P/E |
0.01--0.02 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
C673 |
N/Sb |
[100] |
6" |
675 |
P/E |
0.008--0.020 |
SEMI Prime, 1Flat (57.5mm), Empak cst |
2533 |
N/As |
[100] |
6" |
1,000 |
L/L |
0.0033--0.0037 |
SEMI, 1Flat(57.5mm), in individual wafer cassettes |
E533 |
N/As |
[100] |
6" |
1,000 |
L/L |
0.0033--0.0037 |
SEMI, 1Flat(57.5mm), in individual wafer cassettes |
TS018 |
N/As |
[100] |
6" |
575 ±15 |
P/P |
0.001--0.005 {0.0040--0.0041} |
SEMI Prime, 2Flats (PF @ <110>±1°, SF 135° from PF}, Laser Mark, Empak cst |
4204 |
N/As |
[100] |
6" |
675 |
P/EOx |
0.001--0.005 |
SEMI Prime, 1Flat (57.5mm), Empak cst, Back--side LTO (0.64--0.666)um, TTV<4μm, Bow/Warp<20μm |
5541 |
N/Ph |
[100] |
6" |
675 |
P/EOx |
0.001--0.002 |
SEMI Prime, 1Flat (57.5mm), with strippable Epi layer Si:P (0.32--0.46)Ohmcm, 3.20±0.16μm thick, Empak cst |
TS101 |
N/As |
[100] |
6" |
675 ±15 |
P/EOx |
0.001--0.005 {0.0036--0.0041} |
SEMI Prime, 1Flat (57.5mm), TTV<5μm, LTO (0.3--0.6)μm, Empak cst |
TS037 |
N/Ph |
[111--1.5°] ±0.5° |
6" |
675 |
P/E |
3--12 {5.0--8.8} |
SEMI Prime, 1Flat (57.5mm), Empak cst |
6559 |
N/Ph |
[111] ±0.5° |
6" |
675 |
P/E |
1--100 |
Prime, NO Flats, Empak cst |
TS112 |
N/As |
[111--4°] ±0.5° |
6" |
508 |
P/E |
0.0038--0.0042 |
SEMI Prime, 1Flat (57.5mm), Back--side: LTO 600nm thick, Empak cst |
TS034 |
N/As |
[111--4°] ±0.25° |
6" |
625 ±15 |
P/EOx |
0.0024--0.0035 {0.0029--0.0030} |
SEMI Prime, 1Flat (57.5mm), Back--side: LTO 600nm thick, Empak cst |
TS109 |
N/As |
[111--4°] ±0.5° |
6" |
508 ±15 |
P/E |
0.0023--0.0026 |
SEMI Prime, 1Flat (57.5mm), TTV<8μm, Empak cst |
TS102 |
N/As |
[111--4°] ±0.5° |
6" |
675 |
P/E |
0.001--0.005 |
SEMI Prime, 1Flat (57.5mm), Empak cst, TTV<4μm, Bow<10μm, Warp<20μm |
TS107 |
N/As |
[111--2.5°] ±0.5° |
6" |
625 ±15 |
P/EOx |
0.001--0.004 {0.0021--0.0036} |
SEMI Prime, JEIDA Flat (47.5mm), Back--side LTO (0.45--0.55)μm, TTV<6μm, Empak cst |