Researchers have used D263 Glass wafers cleaving model was investigated based on the principle of thermal stress fracture. The thermal stress in the material was calculated. Experimental studies were performed to investigate the processing parameters, and D263 glass sheet with thickness of 300 µm was cut, resulting in micro crack-free edges with a surface roughness of 0.5 nm. The proposed process was also applied to cut X-ray telescope lenses substrates with no micro cracks. Compared with diamond scribing and laser cutting, the proposed method is lower capital costs and yields a nondestructive cut surface for glass. The technique can be applied in manufacturing glass products (i.e. lenses, solar cells, glass screen).
Researchers have used D263 glass for consistent microchip fabrication with smoothly etched channels for more accurate readings.
University scientists have researched the causes of rough etching including the effect on different glass including D263 glass substrate annealing on improving rough etching and etching of a different form of borosilicate glass. The scientists have discovered that D263 glass has advantages over Borofloat glass wafers.
Our clients use our Schott D263 glass for the following applications:
A scientist asked the following:
"I'd like to get a quote for 1000 D263 wafers, at 500 um thickness. I'd like to know if we can get them with a flat, as it helps in the alignment process. I'd also like to know if you sell quartz wafers that would ideally be transparent from 250 nm to 3000 nm (perhaps you have a transmission profile of a couple?)"
I'm okay with 100 mm diameter but if you have 150 mm it would be good too as they are to but cut for device fabrication. About the d263 wafers, is there a chance for the flat?
What would be the cost difference between big and small quartz wafer per unit?
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