Engineering Wafer Quote Request
Need wafers for engineering research, device fabrication, or prototype testing? UniversityWafer supplies small and large quantities of silicon wafers, glass wafers, SOI wafers, thermal oxide wafers, nitride wafers, sapphire wafers, quartz wafers, and other semiconductor substrates.
Send us your material, diameter, thickness, orientation, dopant, resistivity, polish, coating, and quantity requirements for a fast quote.
Popular engineering wafer options:
- Silicon Wafers
- SOI Wafers
- Thermal Oxide Wafers
- Silicon Nitride Wafers
- Glass Wafers
- Sapphire Wafers
- Fused Silica Wafers
- Silicon Carbide Wafers
Get Your Engineering Wafer Quote FAST!
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Engineering Wafers for Research & Product Development
UniversityWafer supplies engineering wafers for universities, national laboratories, startups, and commercial R&D teams. Whether you're developing MEMS devices, sensors, photonics, power electronics, microfluidics, or semiconductor prototypes, we can provide research-grade substrates manufactured to your exact specifications.
Choose from a wide range of materials including silicon, sapphire, fused silica, quartz, SOI, thermal oxide, silicon nitride, glass, III-V, and II-VI semiconductor wafers. We support projects ranging from proof-of-concept research to pilot production with quantities from a single wafer to volume orders.
Custom Wafer Processing Services
Need more than standard substrates? Our engineering team can help source and process wafers for specialized research applications. Available services include:
- Custom wafer diameters and thicknesses
- Single-side or double-side polished wafers
- Prime, test, and mechanical grades
- Thermal oxide and silicon nitride coatings
- Epitaxial substrates
- High-resistivity and doped silicon wafers
- Precision wafer dicing and custom die sizes
Laser Wafer Dicing Services
Our precision laser wafer dicing service allows researchers to purchase smaller pieces of expensive substrates without sacrificing edge quality. Laser dicing minimizes chipping and mechanical stress, making it ideal for delicate semiconductor materials and thin substrates.
We routinely process:
- Silicon wafers
- Silicon Carbide (SiC)
- Sapphire
- Glass substrates
- Quartz
- Thermal oxide wafers
- Nitride-coated wafers
Typical Laser Dicing Capabilities
| Capability | Typical Range |
|---|---|
| Materials | Silicon, SiC, Sapphire, Glass, Quartz and more |
| Maximum Silicon Thickness | Up to 700 μm |
| Thin Materials | Down to very thin research substrates |
| Coated Wafers | Compatible with many oxide and thin-film coated wafers |
| Production Quantities | Prototype through production volumes |
Whether you need one custom substrate for proof-of-concept testing or hundreds of precision diced wafers for production, UniversityWafer can help accelerate your engineering and semiconductor research projects.
Related Engineering Wafer Resources
- Silicon Wafers
- Custom Silicon Wafers
- Silicon-on-Insulator (SOI) Wafers
- Thermal Oxide Wafers
- Silicon Nitride Wafers
- Sapphire Wafers
- Glass Wafers
- Fused Silica Wafers
- Single Crystal Quartz Wafers
- Silicon Carbide (SiC) Wafers
- Gallium Nitride (GaN) Wafers
- Wafer Processing Services
- Diced Silicon Wafers
- Wafer Bonding
- Semiconductor Device Manufacturing