Wafers (Substrates) & Services

university wafer substrates

Wafers & Services Provided

UniversityWafer, Inc. is the largest international supplier of silicon wafers to universities, industry and government research departments. 

We provide a multitude of wafer services including oxide, nitride, thin film, metal deposition, dicing, bonding reclamation and more.  We can find the most difficult substrate at the best price and smallest quantity in the quickest time possible.  We specialize in small quantity purchases that often lead to larger procurements. Why buy in volume if you don’t have to?

Through our global partners we have created synergies that provide the researcher with products not often available to them.

Get Your Quote FAST! Buy Online and Start Researching Today!


 

 

 

How Do Researchers Work With Us?

Since our beginning over 20 years ago, UniversityWafer, Inc. has help lower the cost of material for researchers everywhere. Once we were the last company to receive a quote, but our low price and fast delivery turned us into an industry leader.

semiconductor services provider

Today we cater to ever corner of the semiconductor industry.   From student researchers to large companies, UniversityWafer, Inc. service is there to cater to the customer’s specific needs in a timely manner.

Try our quoting system.  Researchers use it to either buy directly or use it to lower the price from our competition. We don't mind! We can usually beat any price if we can see the quote.

What Are The Most Commonly Used Services in The Semiconductor Industry?

Semiconductor services is a highly diverse and constantly evolving field with a wide range of services available. However, some of the most commonly used services in the semiconductor industry include:

  1. Design and development: This includes the creation of new semiconductor devices and circuits, as well as the optimization of existing ones.

  2. Fabrication: This is the process of manufacturing the semiconductor devices, including the deposition of materials, etching of patterns, and the formation of interconnections.

  3. Testing and characterization: This involves evaluating the performance of semiconductor devices and circuits to ensure that they meet the required specifications.

  4. Assembly and packaging: This is the process of physically packaging the semiconductor devices and connecting them to other components in a system.

  5. Equipment and process engineering: This involves the development and optimization of equipment and processes used in the semiconductor fabrication process.

These are just a few of the many services available in the semiconductor industry, and the demand for different services can vary depending on the specific needs of a company or project.