Diced Silicon Wafers

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diced silicon on insulator wafers

Diced Silicon Wafers

We can dice any diameter wafer into the dimension you need. Wafer thickness is not a problem.

UniversityWafer, Inc. and our partners provide researchers with creative silicon wafer and other substrate dicing solutions. Using precision diamond saws we can cut a variety of hard brittle materials.

Our Services Include.
Small quantity wafer dicing at an affordable price. Larger volumes are available on request.

Dicing Strengths Include:

  • Make cuts as small as 25 microns wide
  • Perform trenching with variations in depth to < 5 microns over a 4" cut
  • Process wafers as thin as 50 microns
  • Cut wafers as thick as 10 mm
  • Handle wafers as large as 300 mm
  • Cut die as small as 100 microns square
  • Place cuts inside of cuts to create a custom trench profile
  • Make standard entry cuts and plunge cuts
  • Ship in waffle packs, gel packs and on tape & ring

Below are just a few dicing applications that clients have used us for.

Nanotechnology Dicing

  • Micromachining of 75 micron thick Nitinol wire. The wire was cut into 1.8 mm lengths and 3 notches were cut into the sides of the piece. The notches were 38 microns deep and 175 microns wide with 2 notches placed on the opposite side from the third.
  • Micromachining of various sizes of Nitinol springs and tubes.

Biotechnology Dicing

  • Cutting of 750 micron diameter glass and ceramic tubes.
  • Cutting of custom sized microscope slides with delicate surface processing.

Photonics/Optics Dicing

  • Sawing of 1/4" thick quartz photomask.
  • Sawing Silicon/Pyrex material with a special blade to provide an 8 degree sidewall.
  • Providing "near Polished" cuts to eliminate a polishing step for the end customer.

Semiconductor Dicing

  • Delivering cut silicon pieces on non-tack tape to facilitate an automatic pick and place process.
  • Dicing of wafers with very fragile bumps.
  • Cutting and picking of die pieces from a 50 micron thick wafer.

Other Industries

  • Placing high aspect ratio cuts in Ferrite toroids. (50 microns wide and 3.25 mm deep).
  • Precision routing of very small printed circuit boards from panels.