A scientist requested a quote for the following research:
We are looking to fabricate a Si-Glass device with Si microchannels machines into it before anodic bonding. We plan to use 4inch wafers (Si, 500 micron thick), and glass wafers thinner than 170 micron so microscopy through it is feasible. Since quality/spec of Si and glass are critical for successful anodic bonding, BF33 wafers I believe are a good choice to start our work with.
UniversityWafer, Inc. Quoted and Sold the following wafer.
BF33 Item #837
100mm 175um DSP Great or anondic bonding, 60/40 scratch/dig
Borofloat 33 (BF33) is often chosen by researchers for its durability and resistance to thermal shock. BF33 including silica has very low coefficients of thermal expansion. BF33 has a much higher melting point, over 1500 degrees fahrenheit, than other glass. BF33's is often used in research lab equipment, as well as optical and lighting applications.
Borfloat 33 will break, but it will not shatter. Thus it's easier to handle when there is an accident.
Borfloat 33 hypoallergenic and doesn't contain any lead.
When you need the following properties BF33 is the right choice!
UniversityWafer, Inc. can customize your wafer specs. 500 micron thickness for 100mm borofloat 33 wafers. Below a client needed BF33 wafers for bonding with the silicon wafer, and the particle size is required to meet the SEMI standard. We provided 400 micron thick glass.
The below glass wafer spec was used for bonding with the silicon wafer, and the particle size is required to meet the SEMI standard.
4 inch glass wafer (BF33) "SCHOTT"
Diameter: 100 mm±0.1,
Thickness: 400±20 μm
Surface Roughness: <1.5nm (Ra)
TTV: <10 μm,
Surface quality 60/40,
Chamfered edges, Flat edges
We have a large selection of Borofloat 33 glass wafers in all sizes. We have borofloat as thin as 100 microns. Borofloat 33 is the sanme as Pyrex 7740 and have the same anondic bonding properties. Diameters range from smalled diced pieces up to 12 inches.
BOROFLOAT® 33 is a high quality boro-silicate glass with outstanding properties for a wide-range of applications.
This unique special float glass is manu-factured by SCHOTT JENAer GLAS using the Microfloat process and the latest technology. This technology also results in a homogeneous material that has an excellent mirror-like surface, a high degree of flatness and an outstanding optical quality.
BOROFLOAT® 33 is a clear and transpar-ent colourless glass. Its excellent trans-mission and its very weak fluorescence intensities over the entire light spectrum make BOROFLOAT® 33 ideal for a wide range of applications in optics, optoelec-tronics, photonics and analytical equip-ment.
Its low thermal expansion, its high thermal shock resistance and its ability to withstand temperatures up to 450°C for long periods make BOROFLOAT® 33 a good choice for applications which call for good temperature stability (e.g. internal panels in pyrolytic self-cleaning ovens and over plates for high-power floodlights).
BOROFLOAT® 33 is highly resistant to attack by water, strong acids, alkalis as well as organic substances. Therefore it is particularly suitable for applications in the chemical industry such as sight glas-ses for reaction vessels and fittings.
Another interesting field of application is in medical and analytical technology. Measurements are hardly influenced by the glass receptacle because the expo-sure to water and acids results only in the leaching out of small amounts of ions from the glass.
BOROFLOAT® 33 has a lower density than soda lime float glass. It makes it possible to construct lightweight lamina-ted glass systems (e.g. bulletproof glass).
BOROFLOAT® 33 has proven itself in many traditional applications and, today, there is an increasing area of usage in new and technically sophisticated special glass applications such as biotechnology, microelectronics and photovoltaics.
• Home Appliances (interior oven doors, fittings in microwave appliances, window panels for fireplaces)
• Environmental engineering, chemical industry (resistant linings and sight glasses for reaction vessels, microfluidic systems)
• Lighting (protective panels for spotlights and high-power floodlights)
• Photovoltaics (glass for solar collectors)
• Precision engineering, optics (optical filters and mirrors etc.)
• Medical technology, biotechnology (slides, biochips, titration plates, DNA sequencers, microfluidic systems)
• Semiconductor engineering, electronics, sensors (wafers, display glass)
Specification sheet available upon request!
Researchers from the Middle East Technical University and the University of Washington-Seattle have used our 1.1 mm Borofloat33 glass and fused silica glass. These glass items were coated with aluminum by thermal evaporation and annealed at 600 degrees Celsius for 1 hour.
ABSTRACT: Texturing of glass substrate is an alternative novel method for light trapping, which to enhance the absorbed light by way of increasing the diffused transmittance (haze) so that the amount of absorbed light will be increased instead of texturing transparent conductive oxide (TCO). In this study, aluminum induced texturing (AIT) technique is used to texture different type of glasses to see the effect of the chemical composition on surface morphology and optical properties. Improvement in haze values as well as total transmission were obtained in all cases subsequent to texturing. High haze values are obtained by additionally enhancement in total transmission. Surface morphological characterization showed that the composition of glass have direct effect on the textured profile. We speculate that the components of glass other than SiO2 is affecting the density of reaction starting point densities initiation cites on the glass-Al interface. Keywords: Aluminum Induced Texturing (AIT), thin film solar cell, haze...
I need to bond two glass wafers together for my PhD, on one of which there will be a SiO2 layer with some couple hundred nanometer deep features etched in or deposited using liftoff. However, I am facing great difficulty bonding my glass to one another. Even just at the point of the initial bonding and I believe that the glass I am currently using (one polished 1.1mm thick 1 inch square for one substrate and a nondescript 24x24mm square cover slip as the other substrate) is not flat enough, as I am not able whatsoever to get these substrates to even get to initial bonding. I'm pretty sure my cleaning procedure and our clean room facility are adequate to eliminate particle contamination as the culprit, so I have the suspicion that the surface roughness and flatness of the glass I am using is insufficient. I want to experiment with well known flat glass wafers which are used for anodic bonding and see whether these would help. I saw that the wafers with ID 1837 are marked as good for anodic bonding, however they have a 5 week lead time and are probably too thick to use with a x100 objective. Could you advise me on alternative wafers that are similar and are in stock?
UniversityWafer, Inc. Quoted and Client Purchased:
100 mm dia. X .175 mm 60/40 S/D