A wafer fabrication engineer from a domestic Micro Electronics Center (MEC) requested the following quote:
Please quote the following InGaAs Substrates that are 53% indium and 47% gallium.
Epi wafers, In53%Ga47%As on InP[111] Substrate: P/P 2"Ø×350±25µm, InP:Fe[111B], Both-sides-polished, EJ Flats (two). EPI Layer: 0.5µm thick, n-type In53%Ga47%As:Si, Ro>13 Ohm-cm
UniversityWafer, Inc. Answered:
We can offer to make by MOCVD, an Epi layer of InGaAs on InP substrates. We offer In 53%Ga47%As material which is lattice matched to InP. The Epi layer can be undoped, or doped with Si to be n-type or doped with Zn to be p-type. We can produce Epi layers with somewhat different ratio of In to Ga but then the Epi layer lattice will be strained. We can make this on 2" and 3" InP substrates but we cannot do it on 4" InP substrates. The following prices are for budgetary purposes only {they are non-binding). They are based on minimum Epi thickness of 0.5µm. The cost of such Epi wafers varies linearly with Epi layer thickness.
Reference #131300 for specs and pricing.
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Question:
I was wondering if you knew much about the silicon wafer fabrication process. More specifically the kerf waste recovery methods silicon wafer manufactures implement. I have a project and we are trying to estimate the waste generated (around 40% for solar cell fabrication) but also account for waste recovery. There are a lot of waste recovery methods, but I don’t know what is commonly done in industry. Do all solar cell manufactures recycle their Kerf or is it only some percentage of them?
Answer:
In the process of manufacturing solar cells from silicon wafers, a certain amount of the wafer material is lost as kerf waste. Kerf waste is the material that is lost as sawdust or other debris when the wafer is cut into individual solar cells.
The percentage of a silicon wafer that is lost as kerf waste can vary depending on a number of factors, such as the size and thickness of the wafer, the type of saw used to cut the wafer, and the efficiency of the manufacturing process. However, on average, it is estimated that around 30% of a silicon wafer is lost as kerf waste in the production of solar cells.
While kerf waste does represent a significant loss of material, it is worth noting that manufacturers are constantly working to reduce this waste and improve the efficiency of the manufacturing process. This not only helps to minimize the environmental impact of solar cell production but also helps to reduce the cost of producing solar cells, making renewable energy more affordable and accessible to more people around the world.
In the process of manufacturing solar cells from silicon wafers, a certain amount of the wafer material is lost as kerf waste. Kerf waste is the material that is lost as sawdust or other debris when the wafer is cut into individual solar cells.
The percentage of a silicon wafer that is lost as kerf waste can vary depending on a number of factors, such as the size and thickness of the wafer, the type of saw used to cut the wafer, and the efficiency of the manufacturing process. However, on average, it is estimated that around 30% of a silicon wafer is lost as kerf waste in the production of solar cells.
While kerf waste does represent a significant loss of material, it is worth noting that manufacturers are constantly working to reduce this waste and improve the efficiency of the manufacturing process. This not only helps to minimize the environmental impact of solar cell production but also helps to reduce the cost of producing solar cells, making renewable energy more affordable and accessible to more people around the world.
Reference #270981 for the answer.
A post-doctorate researcher were looking to get the quote for a customized wafer design. Please see attached for the schematic. Our silicon nitride layer needs to be stoichiometric LPCVD nitride with a refractive index of 2 at the visible range.
Reference #254398 for specs and pricing.
Wafer fabrication is the process of creating wafers, which are thin, flat discs used 
as the base material for the fabrication of microelectronic devices, such as integrated circuits (ICs). The wafer fabrication process involves a series of steps, including wafer cleaning, photolithography, etching, and doping, among others. These steps are carried out using specialized equipment and materials, such as photolithography machines, chemical etchants, and dopants. The goal of wafer fabrication is to create a pattern of electronic components on the surface of the wafer that can be used to make integrated circuits.
Silicon wafers are commonly used as the base material for the fabrication of microelectronic devices, such as integrated circuits (ICs). The process of fabricating microelectronic devices with silicon wafers typically involves a series of steps, including wafer cleaning, photolithography, etching, and doping, among others. These steps are carried out using specialized equipment and materials, such as photolithography machines, chemical etchants, and dopants. The goal of the fabrication process is to create a pattern of electronic components on the surface of the silicon wafer that can be used to make the desired microelectronic device.
Silicon substrates are commonly used as the base material for the fabrication of integrated circuits (ICs). The process of fabricating ICs on silicon substrates typically involves a series of steps, including wafer cleaning, photolithography, etching, and doping, among others. These steps are carried out using specialized equipment and materials, such as photolithography machines, chemical etchants, and dopants. The goal of the fabrication process is to create a pattern of electronic components on the surface of the silicon substrate that can be used to make the desired IC. Silicon is used as the substrate material because it is a good conductor of electricity, it can be easily processed, and it is relatively inexpensive.
Photolithography is a key step in the process of fabricating silicon wafers for microelectronic devices, such as integrated circuits (ICs). In this process, a patterned mask is used to selectively expose parts of a photoresist layer that has been coated onto the surface of the silicon wafer. The exposed parts of the photoresist are then selectively removed, either by developing the photoresist or by using a special etching process, depending on the type of photoresist that is used. This process is repeated multiple times, using different masks and photoresist layers, to create a pattern of electronic components on the surface of the silicon wafer that can be used to make the desired IC. Photolithography is an important step in the IC fabrication process because it allows for precise control over the placement and shape of the electronic components on the wafer.
A Wafer Fabrication Engineer in the semiconductor industry is responsible for overseeing the production of semiconductor wafers, which are the building blocks of electronic devices. They play a crucial role in the manufacturing process, ensuring that the wafers are produced to high quality standards and in a timely manner.
The specific roles and responsibilities of a Wafer Fabrication Engineer may vary depending on the company and the level of seniority, but generally, their duties include:
Designing and developing manufacturing processes for semiconductor wafers: This involves creating process flow diagrams, determining the appropriate equipment and materials to be used, and optimizing the process for maximum efficiency and yield.
Conducting process evaluations and troubleshooting: The engineer is responsible for identifying any issues that may arise during the production process, and finding solutions to address them. This may involve working with cross-functional teams to determine the root cause of the problem and implementing corrective actions.
Managing equipment maintenance and calibration: The engineer oversees the maintenance and calibration of the equipment used in the fabrication process, ensuring that it is functioning properly and meeting the required specifications.
Implementing quality control measures: The engineer is responsible for ensuring that the wafers produced meet the required quality standards. This may involve developing and implementing quality control procedures and conducting statistical process control to monitor and maintain quality.
Managing projects: The engineer may be responsible for managing projects related to wafer fabrication, which may involve coordinating with other departments, managing timelines and budgets, and ensuring that the project is completed on time and within budget.
Overall, a Wafer Fabrication Engineer plays a critical role in ensuring that semiconductor wafers are produced efficiently, with high quality, and within budget. Their skills and expertise are essential to the success of semiconductor manufacturing companies, and they are a key contributor to the advancement of technology in the industry.