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The lapping of Silicon Wafers is a process that has been around as long has substrates needed a very flat and polished surface. The lapping techinique is to this day the best machining process that gives the silicon substrate a higher quality finish that are characterized by isotropic properties.
After slicing the ingot there is usually a mechanical double side polished lapping step to remove damage left by slicing to achieve a high degree of parallelism and flatness of the wafer. Lapping performed under rotational pressure with pads and an abrasive slurry mixture that typically consists of alumina or silicon carbide and glycerine. Flatness is a critall wafer parameter for many process steps in the wafer fabrication process.
A polished wafer edge finish (also called ege grind) is applied to the wafer to contour a smooth radius on the edge of the wafer create mechanical stress in the wafer that activates crystal dislocations, especially during thermal process steps that occur in the wafer fabrication. Crevices can also be the source of unwanted contamination buildup as well as particulate flaking during fabrciation. A smooth edge readius is important to minimize these concerns. Futhermore, chipped edges are a source of edge dislocation growth during thermal cycles in the wafer fabrication process.
UniversityWafer, Inc. uses a polishing pad along with polishing liquid to to remove excess silicon from a wafer surface. The reason for Lapping process is to de-stress the ingot during slicing. Lapping also removes defects on the both sides of the wafer's surface.
Below are just some of the Lapped Silicon Wafers that we have in stock.
|Item #||Qty||$/Wafer||Type/Dopant||Orient.||Dia(mm)||Thick(μm)||Polish||Res Ωcm||Notes|
|2533||2||$100.00||n-type Si:As||||6"||1,000||L/L||0.0033-0.0037||SEMI, 1Flat(57.5mm), in individual wafer cassettes|
|E533||1||$100.00||n-type Si:As||||6"||1,000||L/L||0.0033-0.0037||SEMI, 1Flat(57.5mm), in individual wafer cassettes|
|7201||150||$4.00||n-type Si:P|| ±3°||156x156||150 ±10||L/L||1--7||PSQ (Pseudo-Square), PV, Coin-roll packed|
|E189||48||$35.00||n-type Si:P||||4"||300||L/L||FZ 1,100-1,600||SEMI, 1Flat, Empak cst|
|D189||25||$35.00||n-type Si:P||||4"||300||L/L||FZ 800-1,500||SEMI, 1Flat, Empak cst|
|H189||25||$35.00||n-type Si:P||||4"||300||L/L||FZ 800-1,500||SEMI, 1Flat, Empak cst|
|X7299||50||$3.00||n-type Si:As||[111-4°]||4"||525||L/L||SEMI TEST (in Opened Empak cst), 2Flats (2nd @ 45°)|
|D10||298||$5.00||n-type Si:P||||2"||400||L/L||120-170||Lapped & edged|