Silicon Nitride Wafers with LPCVD and PECVD
Silicon Nitride Wafers LPCVD and PECVD in stock!
We have a large selection of:
Wafers in stock in small and large quantities.
Buy as few as one Niride Wafer!
Stoichiometric LPCVD Nitride
Our Standard nitride film works great as hard mask for KOH etching and can be used as a tool for defining active regions during field oxidation.
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Silicon Nitride Strengths
Nitride has good high temperature strength, creep resistance and oxidation resistance. Silicon Nitride's low thermal expansion coefficient gives good thermal shock resistance.
Silicon Nitride is produced in three main types; Reaction Bonded Silicon Nitride (RBSN), Hot Pressed Silicon Nitride (HPSN) and Sintered Silicon Nitride (SSN). We have Silicon Nitride all dimaeters, specs and quanities.
We can deposit Nitride onto the following diameters
- 25.4mm
- 50.8mm
- 76.2mm
- 100mm
- 150mm
- 200mm
- 300mm
Silicon Nitride Wafers LPCVD and PECVD in stock!
We have a large selection of:
- Stochiometric Nitride
- Low Stress Nitride
- Super Low Stress Nitride
Wafers in stock in small and large quantities.
Buy as few as one Niride Wafer!
Stoichiometric LPCVD Nitride
Our Standard nitride film works great as hard mask for KOH etching and can be used as a tool for defining active regions during field oxidation.
Low Stress Nitride
Our Low Stress Nitride retains all of the same benefits associated with our standard nitride but can also be used for Membranes, Cantilever Beams and other mechanical structures associated with MEMS devices.
Super Low Stress Nitride
Our Super low stress nitride has been developed for applications that require extremely low film stress. Film Stress can also be customized to meet your unique specifications.
New PECVD Nitride Services
PECVD Nitride
is a single sided film that has been optimized for wafers requiring minimal thermal processing.
Because PECVD Nitride is deposited at low temperatures, it offers greater flexibility and can be deposited over any of our other thin films.
PECVD OxyNitride
A single sided film that has been optimized for
wafers requiring minimal thermal processing.
Because PECVD OxyNitride is deposited at low temperatures, it offers greater flexibility and can be deposited over any of our other thin films.
Low Stress PECVD Nitride
A single sided film that has been optimized for wafers requiring minimal thermal processing. Because Low Stress PECVD Nitride is deposited at low temperatures, it offers greater flexibility and can be deposited over any of our other thin films.
PECVD Oxide
A single sided film that has been optimized for wafers requiring minimal thermal processing. Because PECVD is a deposited oxide, it offers greater flexibility than thermal oxide and can be deposited over any of our other thin films.
PECVD Silicon Carbide
for wafers requiring minimal thermal processing.
Because PECVD Silicon Carbide is deposited at low temperatures, it offers greater flexibility and can be deposited over any of our other thin films