A post-doctoral researcher requested a quote for the following.
I am a post-doctoral researcher and I plan to synthesize some nanoparticles on Si wafer as substrate. Because these experiments take place in a context of fundamental research and I am not sure about the results, I am wondering if you would have some wastes of Si wafers with the 100 orientation that you could send to me.
I am interested in the product with the number: UW3N100. As it will be dedicated for fundamental science and I am not sure about the results, I would like to know if it will be possible to purchase a quantity of 5 items of this product.
Silicon Wafers Used To Fabricate Gold Nanoparticles
A PhD student requested a quote for the following.
I want to use P-type, c-Si as a substrate
to fabricate gold nanoparticles with rf sputtering
and PLD.The Au nanoparticles will be deposited on
Si substrate.
Kindly give me the correct p-type, c-Si wafers. i
am not too sure of specification information.
Please your urgent quotation will be appreciated.
Reference #118105 for specs and pricing.
Coating Metal Nanoparticles
A graduate student requested a quote for the following.
We want to order some SOI wafers to conduct our
experiment. Our goal is to coat metal
nanoparticles onto the SOI to see if
photocurrent could be enhanced. I saw
lots of options of SOI on the website. Do
you have any idea which one is suitable
in our case? Also, could you send me a
list with price of SOI in stock?
Reference #124654 for specs and pricing.
SEM Analysis of Fixed Cells
A postdoc requested a quote for the following.
I need the waffers for SEM analysis of fixed cells
marked with Gold Nanoparticles. I need low
resistivity for better charge dissipation.
Reference #125675 for specs and pricing.
Self-Assembly of Nanoparticles
A postdoc requested a quote for the following.
I am interested in having some Al2O3 and ZnO wafers. What is the per wafer price of ZNO0849A, ZNO0850A, ZNO0849B and Al2O3 wafers. My application is regarding self-assembly of nanoparticles. So, I would like to have transparent and smooth (polished) substrates and be resistant to HF acid. Also, do you send out samples?
Reference #148195 for specs and pricng.
What Substrate is Used to Fabricate Nanoparticles?
Silicon wafers are commonly used as a substrate for fabricating nanoparticles. Some of the specifications that are used to fabricate nanoparticles on silicon wafers include:
Wafer thickness: The thickness of the silicon wafer can affect the size and shape of the nanoparticles that are formed. A thinner wafer may be used for smaller nanoparticles, while a thicker wafer may be used for larger nanoparticles.
Wafer Orientation: The crystal Orientation of the silicon wafer can affect the growth of the nanoparticles. For example, using a <100> silicon wafer can result in nanoparticles with a preferred Orientation.
Surface quality: The surface quality of the silicon wafer affects the ability of the nanoparticles to adhere to the substrate. A clean, smooth surface will promote better adhesion of the nanoparticles.
Surface chemistry: The surface chemistry of the silicon wafer affects the ability of the nanoparticles to adhere to the substrate. A silicon wafer coated with a thin layer of oxide or nitride can promote better adhesion of the nanoparticles.
Wafer doping: doping the silicon wafer with impurities can affect the electrical and optical properties of the nanoparticles that are formed.
These are some of the common specifications used for fabricating nanoparticles on silicon wafers. However, the specific requirements may vary depending on the application and the type of nanoparticles being fabricated.
This illustration shows how nanoparticles are used on a silicon wafer:
The large circular object represents a silicon wafer with a grid pattern showing integrated circuit layouts
Blue nanoparticles are deposited on specific locations of the wafer
The magnified inset in the upper right shows a closer view of these nanoparticles on the circuit patterns
In semiconductor manufacturing, nanoparticles serve several important functions:
They're utilized in photolithography processes to create precise patterns
They can function as catalysts for specific chemical reactions during fabrication
Some nanoparticles are incorporated into materials to enhance conductivity or other properties
The size of these nanoparticles typically ranges from 10-100nm, which is critical for working with modern semiconductor features that can be as small as a few nanometers.
How To Deposit Nanoparticles on Silicon Wafers?
Depositing nanoparticles onto silicon wafers can be done in several ways, depending on the type of nanoparticles, the desired coverage, and the application. Here are some of the most common methods:
1. Drop Casting
Process: A droplet of nanoparticle suspension is dropped onto the silicon wafer and allowed to dry.
Process: A solution containing nanoparticles is dropped onto the wafer, which is then spun at high speed to spread the solution thinly and uniformly.
Pros: Good control over thickness and uniformity.
Cons: Wasteful with material, best for small-scale applications.
3. Dip Coating
Process: The wafer is dipped into a nanoparticle solution and then withdrawn at a controlled rate.
Pros: Simple and scalable.
Cons: Uniformity depends on withdrawal speed and solution properties.
4. Langmuir-Blodgett (LB) Deposition
Process: Nanoparticles are spread on a water surface, compressed into a monolayer, and then transferred to the wafer by dipping.
Pros: Excellent control over monolayer formation.
Cons: More complex setup; limited to certain types of nanoparticles.
5. Self-Assembly / Surface Functionalization
Process: The wafer surface is chemically modified (e.g., with silane molecules) to attract nanoparticles from a solution.
Pros: Can yield highly ordered structures.
Cons: Requires precise surface chemistry control.
6. Electrophoretic Deposition
Process: An electric field is applied to drive charged nanoparticles from a solution onto a wafer (which acts as an electrode).
Pros: Allows for controlled deposition over large areas.
Cons: Only works for charged particles in suitable solvents.
7. Aerosol or Spray Coating
Process: Nanoparticles in a solvent are sprayed or atomized onto the wafer.
Pros: Scalable and suitable for large areas.
Cons: May require masking or post-processing for patterning.
8. Inkjet Printing / Microcontact Printing
Process: Nanoparticles are precisely deposited in patterns using inkjet heads or patterned stamps.
Pros: Precise patterning and low material waste.
Cons: Equipment-intensive and may require formulation tuning.
Let me know your specific nanoparticle type or application—some methods are better suited for metallic particles, quantum dots, or biological materials.
