Thin Silicon Wafers for Research & Production

university wafer substrates

Thin Silicon Wafers

Whey spend more on thin silicon wafers when we sell them for a deep discount to our competitors.

Thicknesses <10um available from diameters <25.4mm - 300mm.

Please send us your specs today!

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Thin Silicon Wafers for Microfluidic Devices

Researchers use the following thin silicon wafer spec for the fabrication of a microfluidic device (acoustics of droplets). The researcher will bond the silicon to a borosilicate glass and dry etch the channels all the way down the 150 µm.

UniversityWafer, Inc. Quoted and the researcher purchased:

Si wafers, 4", 150 µm thin, DSP (10 pieces). Contact us for pricing. Reference #262858



thin silicon for research and production

100 micron Thin Silicon for as an Optical Element

A researcher contacted us for the the following research.

I would like to use a thin silicon wafer as an optical element in the the mid-IR 6-12um (pulsed). We want to use it in transmission and also make use of the double reflections etc. with as little changes to spectrum and wavefront as possible. Size 25.4mm, Thickness 70-120 um, undoped, DSP , TTV small as possible Qty. 1-10

UniversityWafer, Inc. Quoted The Following:

Diam 25.4mm, 100+/-20um, DSP, FZ>3000 OHM-CM
Quantity: 10 Pieces
FOB Price: $ Contact Us
Delivery Time: 2-4 weeks


Thin Silicon for FTIR

A researcher contacted us for a quote for thin silicon that his lab could used for Fourier Transform Infrared Spectroscopy (FTIR) of thin films on Si wafer in transmission mode. The researched needed double side polished wafers.

The following wafers worked.

Si Wafer
4", 250um, DSP, P<100>, 10-40 ohm-cm
FOB Price: Depends on Quantity

Please let us know if the above spec would work for you or if you need another item.

Thin Silicon Wafers to Fabricate a Microfluidic Device

A research scientist from a large hardware tech company requested the following.

I'd like to order thin silicon wafers as follows: Silicon thickness: 100 um to 150 um silicon dioxide layer: 0.1um on both sides polich: DSP diameter: min 25 mm dopent: none is preferred ( though any dopant is acceptable for this application) grade: prime quantity: MOQ Please send me a quotation with lead time. 

We want to laser cut the wafer to create a substrate for a microfluidic device. Then we plasma bond it to a pdms sheet. DSP and oxide layers are essential for plasma bonding. We don't perform any lithography processes on the wafer.

UniversityWafer, Inc. provided the following spec:

100mm P/B <0.01 Ohm-cm 100+/-10um DSP

Researchers Use Thin Silicon Wafers to Replace Glass Cover Slips


I am looking for thin pieces of Si wafers, <50 um thick and preferably in square or rectangular shape. In the end I need pieces that are 10x10 or 10x20 mm in size. Do you have anything to offer? I am planning to use this as a replacement for a thin cover glass. Small volumes, depending on if you want to sell a full wafer or diced squares.

UniversityWafer, Inc. Quoted:

Tthin pieces of Silicon Wafers, <50 um thick and in Ø25.4mm round shape,double sides polished, P-type <100>, 1~20 ohm-cm, Qty 10pcs

Price depends on quantity. Please reference #261800 when you contact us regarding the specs above.

What Silicon Wafers are Used in Integrated Photovoltaics

Integrated photovoltaics can be described as the next generation of photovoltaic technology. They are capable of producing electricity in urban areas that have limited land and also serve as architectural elements. Integrating photovoltaics in buildings and electronic devices requires flexibility, color tunability and efficiency as well as scalability and stability. Integrated photovoltaics must demonstrate all-around performance advantages. This is because photovoltaic performances are in a tradeoff relationship, such as transparency and efficiency. 

Thin Si Item #3747
100mm P/B (100) <0.01 ohm-cm 100um DSP Prime Grade
TTV <10um, Bow/Warp <30um, 2-Flats (We have TTV <1um. Please let us know what flatness you need)

These are great transparent solar cells (TSCs) that offer high flexibility, high transparency and color-tunable solar cell performance. TSCs have an efficiency of 7.38 and 5.52%, with average visible transparencies of 45 and 60 percent, respectively. TSCs are also more flexible due to the introduction of a periodic hole array structure. After PDMS embedding, the minimum bending radius drops to 6 mm. It further reduces to 3 mm. The numerical simulation shows that the periodic hole array structure distributes stress uniformly across the entire area, acting as a self-stress relief structure. TSCs embedded with PDMS have unprecedented flexibility and stability, even in the face of cyclic bending and heat tests up to 1000 cycles.