Custom Silicon Wafers for Research & Development 

Custom silicon wafers are available with specialized diameters, thicknesses, crystal orientations, dopants, resistivities, surface finishes, and thin-film coatings to support semiconductor manufacturing, MEMS fabrication, photonics, sensors, power electronics, microfluidics, and advanced materials research. UniversityWafer supplies research-grade and production-ready silicon substrates including ultra-thin wafers, low TTV wafers, SOI wafers, epitaxial silicon, thermal oxide wafers, silicon nitride coated wafers, and precision diced silicon components.

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Custom Silicon Wafers for Research, Development, and Production

UniversityWafer, Inc. supplies custom silicon wafers for semiconductor research, MEMS fabrication, photonics, microelectronics, sensors, power devices, and commercial production. We specialize in sourcing and fabricating silicon substrates that meet unique specifications, from prototype quantities to full production volumes.

Our silicon wafers are available in diameters ranging from less than 1 inch to 300mm (12 inches), with custom thicknesses, crystal orientations, resistivities, and surface finishes available upon request. Whether you need a single wafer for research or a recurring production supply, our team can help develop a substrate that meets your exact requirements.

Custom wafer options include:

  • Ultra-thin silicon wafers (100µm and thinner)
  • Low TTV silicon wafers (<1µm)
  • Low bow and low warp substrates
  • Extra-thick silicon wafers up to 12mm
  • Custom crystal orientations
  • Prime, test, and mechanical grades
  • Single-side polished (SSP) wafers
  • Double-side polished (DSP) wafers
  • Custom diameters and shapes

Small quantity orders are welcome. Many custom specifications can be supplied in prototype quantities, making UniversityWafer a valuable resource for universities, government laboratories, startup companies, and research institutions.

Custom Wafer Thinning, Dicing, and Laser Cutting Services

In addition to supplying new silicon wafers, we offer wafer modification services including wafer thinning, reclaim processing, laser cutting, and precision dicing. Existing substrates can often be reworked to meet new project requirements while reducing overall material costs.

Custom silicon can be fabricated into:

  • Diced chips
  • Custom rectangles and squares
  • Circular substrates
  • Silicon cubes
  • Custom geometries
  • Prototype device substrates

These services are frequently used for semiconductor device development, photonics research, microfluidics, MEMS fabrication, packaging development, and materials science investigations.

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Custom Silicon Wafer Services Available

UniversityWafer provides custom silicon wafers for semiconductor research, MEMS development, photonics, sensors, power devices, university laboratories, and production applications. Whether you need a single prototype wafer or a large production run, custom specifications can be fabricated to meet your exact requirements.

  • Low TTV Silicon Wafers (<1µm)
  • Low Bow and Warp Silicon Wafers
  • Ultra-Thin Silicon Wafers (100µm and thinner)
  • Extra-Thick Silicon Wafers (1mm to 12mm)
  • Custom Crystallographic Orientations
  • Single-Side Polished (SSP)
  • Double-Side Polished (DSP)
  • Thermal Oxide Silicon Wafers
  • Silicon Nitride Coated Wafers
  • Epitaxial Silicon Wafers
  • Silicon-on-Insulator (SOI) Wafers
  • Custom Wafer Dicing and Laser Cutting

Custom Silicon Wafer Specifications

Custom silicon wafer fabrication and specialty silicon substrates

Researchers often require silicon wafers that fall outside standard semiconductor specifications. Custom wafers can be fabricated with specialized dimensions, thicknesses, orientations, resistivities, oxide layers, and surface finishes.

Available options include:

  • Diameters from less than 1 inch to 300mm (12 inch)
  • Custom thicknesses from ultra-thin to extra-thick
  • P-type and N-type doping
  • Float Zone (FZ) or Czochralski (CZ) silicon
  • Custom notch and flat configurations
  • Prime, test, and mechanical grades
  • Custom resistivity ranges

These custom specifications allow engineers and scientists to optimize substrates for specific device architectures and fabrication processes.

Custom Wafer Orientations

UniversityWafer can supply wafers with standard and specialty crystallographic orientations. While <100> and <111> orientations are common, many research projects require less common orientations and custom off-cuts.

Available orientations include:

  • <100>
  • <111>
  • <110>
  • <112>
  • <211>
  • <510>
  • Custom off-axis orientations

Custom crystal orientations are frequently used for MEMS fabrication, anisotropic etching, photonics, and advanced semiconductor device development.

Ultra-Thin Silicon Wafers

Thin silicon wafers are commonly used in MEMS, sensors, flexible electronics, microfluidics, advanced packaging, and biomedical devices. These wafers can be manufactured with extremely tight thickness tolerances and low total thickness variation.

Benefits of thin silicon wafers include:

  • Reduced device weight
  • Improved thermal performance
  • Enhanced flexibility
  • Lower material consumption
  • Compatibility with advanced packaging technologies

Silicon-On-Insulator (SOI) and Epitaxial Wafers

Custom SOI wafers and epitaxial silicon substrates are available for advanced semiconductor research. These specialty wafers are widely used in photonics, RF electronics, MEMS devices, power electronics, and integrated circuits.

Custom SOI wafers can be fabricated with:

  • Custom device layer thickness
  • Custom BOX thickness
  • Various wafer diameters
  • Special resistivity requirements
  • Custom crystal orientations

Epitaxial silicon wafers can also be supplied with custom epi thicknesses and doping profiles.

Wafer Processing Services

In addition to supplying wafers, UniversityWafer offers a variety of custom processing services that allow customers to receive wafers ready for fabrication and research.

  • Wafer slicing
  • Lapping
  • Chemical etching
  • Chemical mechanical polishing (CMP)
  • Thermal oxidation
  • Nitride deposition
  • Wafer thinning
  • Laser cutting
  • Custom dicing

These services help reduce processing time and simplify prototype development for researchers and engineers.

Custom Silicon Wafers for Research and Production

Whether you require a single prototype wafer, a university research quantity, or a production lot, custom silicon wafers can be manufactured to meet exact specifications. Small quantity orders are welcome, and custom fabrication options are available for virtually every stage of semiconductor development.

Applications include semiconductor manufacturing, MEMS, sensors, power devices, photonics, nanotechnology, microfluidics, RF electronics, and advanced materials research.

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