Just looking for some polished CZ wafers, 3" diameter x 1/4" thickness. We’re going to be coating these with mirrors, so as long as they’re well-polished (flatness < λ/10 @ 632nm, roughness < 5 Angstrom RMS), they’ll be good enough for us.
A materials engineer requested a quote for the following:
Just looking for some polished CZ wafers, 3" diameter x 1/4" thickness. We’re going to be coating these with mirrors, so as long as they’re well-polished (flatness < λ/10 @ 632nm, roughness < 5 Angstrom RMS), they’ll be good enough for us.
UniversityWafer, Inc. Quoted
tem Qty. Description
CO36. 10/25 Silicon wafers, per SEMI Prime, P/E 3"Ø×6,350±50µm, (1/4") n-type Si:P[111]±0.5°, Ro=(1-100)Ohmcm, can accept p-type
One-side-polished, back-side Alkaline etched, SEMI Flats (two),
Roughness<5A RMS. Sealed in Individual Wafer cassette.
Reference #150785 for specs and pricing.
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Surface roughness of silicon wafers is a critical parameter in semiconductor manufacturing, affecting the quality and performance of the final semiconductor devices. It's measured using several techniques, each with its advantages and specific applications. Here are the primary methods used for measuring the surface roughness of silicon wafers:
Atomic Force Microscopy (AFM): AFM is a high-resolution scanning probe technique that provides topographical data of the surface at the nanometer or even atomic scale. A sharp tip on a cantilever scans across the wafer's surface, and the deflection of the cantilever due to the surface topology is measured. AFM is highly accurate and can measure very fine surface features, but it's relatively slow and typically covers small areas.
Optical Profilometry : This non-contact method uses light to measure the surface topography. There are various optical profilometry techniques, such as white light interferometry and laser scanning confocal microscopy. These methods project light onto the surface and analyze the reflected light to determine surface roughness. Optical profilometry can quickly measure large areas compared to AFM but may not achieve the same resolution on the nanometer scale.
Stylus Profilometry (Contact Profilometry) : In this method, a diamond-tipped stylus is mechanically moved across the wafer surface. The vertical movements of the stylus, as it tracks the surface topography, are recorded to measure roughness. Stylus profilometry can provide accurate measurements of surface roughness and is effective for a wide range of roughness levels. However, it's a contact method, which means there's a risk of damaging the wafer surface, especially for very delicate or thin wafers.
Scanning Electron Microscopy (SEM): SEM provides high-resolution images by scanning the surface with a focused beam of electrons. While SEM is primarily used for imaging, the images can also be analyzed to estimate surface roughness. This technique is useful for detailed analysis of surface features but is more complex and time-consuming than other methods.
X-ray Reflectivity (XRR) : XRR is a non-contact, non-destructive technique used to measure the density, thickness, and roughness of thin films on silicon wafers. It involves measuring the intensity of X-rays reflected from the surface as a function of incident angle. XRR is particularly useful for thin film analysis but may not be suitable for measuring roughness on bulk silicon wafers.
Each of these methods has its specific use cases, advantages, and limitations. The choice of technique depends on the required resolution, the area to be measured, the nature of the surface (e.g., whether it's a thin film or bulk material), and whether contact with the wafer surface is acceptable.
Checking the texture of silicon wafers is key—think smoother than a skater on ice. This stuff matters, especially when you're dealing with semiconductors. Those silicon slices? They lay the groundwork for all those tiny gadgets we can't live without. The importance of surface roughness measurement can be understood through its impact on the following aspects:
Device Performance : Surface roughness can significantly affect the electrical properties of semiconductor devices. When surfaces are rough, it scatters the charge carriers around, cranking up the electrical resistance and dialing down device efficiency. When you're dealing with cutting-edge tech like top-tier CPUs, GPUs, or memory units, keeping everything super smooth on the surface is key to nailing that electrical efficiency.
Thin Film Adhesion : Many semiconductor device manufacturing processes involve the deposition of thin films on silicon wafers. The adhesion of these films can be highly dependent on the surface roughness of the underlying wafer. When you've got a smoother wafer, it really sticks better and the coating's evenness plays a huge part in making sure your gadgets work like they should.
Photolithography Quality : Photolithography is a key process in semiconductor manufacturing, where patterns are transferred onto the wafer surface to define the structures of microelectronic devices. Surface roughness can affect the quality of photolithography by causing defocus or distortion of the pattern, leading to defects in the manufactured devices. For ultra-precise device production, ensuring the wafer's surface is flawlessly smooth is absolutely key.
Optical Properties : For devices that rely on optical properties, such as LEDs, lasers, and photovoltaic cells, surface roughness can influence the efficiency of light absorption and emission. Polishing up the surface can really bump up how well these gadgets work, because it cuts down on light getting bounced off or scattered.
Reliability and Yield : Surface defects and irregularities associated with high surface roughness can be initiation sites for crack propagation and other failure mechanisms in semiconductor devices. Keeping devices smooth on the surface not only boosts their toughness but also ramps up how many make it through production without a hitch.
Process Control and Optimization : Measuring surface roughness is an important tool for process control and optimization in semiconductor manufacturing. By monitoring surface roughness, manufacturers can adjust their processes (e.g., polishing, etching, deposition) to achieve the desired surface quality, leading to more consistent and higher-quality products.
So, keeping tabs on how smooth the silicon wafer is turns out to be super important—it's all about making sure those tiny chips work like a charm and that factories can pump them out without a hitch.