Defect Density of Substrates

university wafer substrates

High Quality Silicon Wafers With Minimal Defect Density

An adjunct professor requested a quote for the following Silicon-on-Insulator wafers.

Ii need some SOI with thin device layer somewhat urgently. I need high quality silicon (minimal micropipes or defect density).

Please send us what you have.

Reference #90404 for specs and pricing.

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Defect Density of 200mm Silicon Wafer's Surface

A Senior Optical Researcher requested a quote for the following:

Can I get more detailed spec for your 200mm P(100) FZ >100 ohm-cm SSP 750um Prime grade?  To be more specific, I’m looking for the defect density on the wafer surface.  If possible, could you send me quote for 50 wafers of each item? 

Reference #110282 for specs and pricing.

Defect Density of Silicon Carbide Wafers to Research Power Schottky Diodes

A university professor from an electronics and microelectronics department requested a quote for the following:

I'm interested in SiC wafers. I am interested in is 4H of varying quality.
Do you have a defect density specification for SiC wafers?

I have just established that we want 4H polytype SiC. Small sizes of different quality if possible, e.g. 10mm x 10mm substrates if possible.
I presume that MPD means Micro Pipe Density. Is a variety of quality in this parameter possible?

Single side polished. High resistivity and low resistvitiy is also desired and both p and n-type.

I am interested in getting a variety of 4H SiC.

One piece of low resistivity (e.g. 10E19cm-3 n-type and one similar p-type is also of interest, single side polished

(I want to investigate power Schottky diodes and investigate ohmic contacts, if that information assists you in any way)

Thicker substrates is of interest but not essential. 330um is fine.

Excuse my ignorance - what does 'on-axis mean'?

Reference #113930 for specs and pricing.

How Do You Determine The Defect Density Of A Substrate?

The defect density of a substrate, often important in fields like materials science and semiconductor manufacturing, is typically determined by evaluating the number of defects present in a given area of the material. The process can vary depending on the type of substrate and the nature of the defects but generally involves the following steps:

  1. Sample Preparation: The substrate must be prepared so that its surface is suitable for examination. This might include cleaning and sometimes sectioning the material for better inspection.

  2. Defect Identification and Imaging: Defects are identified using various imaging techniques. Common methods include optical microscopy, scanning electron microscopy (SEM), and atomic force microscopy (AFM). These techniques allow for high-resolution imaging of the surface, making it possible to identify even very small defects.

  3. Defect Classification: Defects are often classified based on their type (like dislocations, grain boundaries, voids, or impurities) and size. This classification helps in understanding the impact of these defects on the material's properties.

  4. Counting and Measurement: The defects identified are counted, and their dimensions are measured. This is often done using image analysis software that can automate the detection and measurement process.

  5. Calculating Defect Density: The defect density is calculated by dividing the total number of defects by the area of the substrate that was inspected. This is usually expressed in defects per unit area (e.g., defects/cm²).

  6. Statistical Analysis: Often, multiple measurements are taken to ensure accuracy and reliability. Statistical methods are applied to these measurements to account for variability and to provide a more accurate estimate of the defect density.

  7. Comparative Analysis and Reporting: The results are often compared with industry standards or specifications to determine the quality of the substrate. The findings are then reported, usually including both quantitative data (like defect density) and qualitative observations (like the nature of the defects).

It's important to note that the specific methods and technologies used can vary widely depending on the type of substrate and the requirements of the application. Advanced substrates used in semiconductor manufacturing, for instance, require extremely precise and sophisticated techniques due to the small scale and high impact of defects.

Zero-Defect Density Undoped FZ Silicon

A PhD candidate requested a quote for the following:

We need undoped-FZ silicon, orientation [111]+/- 0.5 deg., 1 standard flat. We usually specify “zero-defect density” when purchasing bulk material – I don’t know if this means anything to you. Ideal thickness is 400um or as close as possible greater than that. Wafer finish should meet industry standard for flatness.

Reference #152081 for specs and pricing.