Silicon Wafers for Research and Device Fabrication
The density of silicon is approximately 2.329 g/cm³, or 2,329 kg/m³, at room temperature. This value is used in semiconductor process modeling, wafer mass calculations, MEMS design, thermal analysis, stress simulation, and materials characterization.
Key Silicon Material Values
- Density: 2.329 g/cm³
- Density: 2,329 kg/m³
- Crystal structure: Diamond cubic
- Atomic number: 14
- Atomic mass: 28.085 u
- Melting point: Approximately 1,414°C
UniversityWafer supplies silicon wafers for semiconductor devices, integrated circuits, photovoltaics, MEMS fabrication, photonics, sensors, microfluidics, and university research.
Request a Silicon Wafer Quote
Tell us the wafer diameter, thickness, crystal orientation, conductivity type, resistivity, surface finish, quantity, and any required films or processing. We can help identify a suitable silicon substrate for your experiment or fabrication process.
Get Your Silicon Wafer Quote FAST! Or, Buy Online and Start Researching Today!
Silicon Wafer Specifications to Include
- Diameter: 2 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch, or 12 inch
- Crystal orientation: <100>, <111>, or another orientation
- Conductivity: P-type, N-type, or intrinsic silicon
- Dopant: Boron, phosphorus, arsenic, antimony, or undoped
- Resistivity: Low, standard, high, or ultra-high resistivity
- Thickness: Standard, thin, ultra-thin, or custom
- Surface finish: Single-side polished, double-side polished, or unpolished
- Additional layers: Thermal oxide, silicon nitride, epitaxy, or deposited films
Silicon Wafer Options
Depending on the application, researchers may require different wafer grades and structures. UniversityWafer provides:
- Prime- and test-grade silicon wafers
- Silicon-on-insulator wafers for MEMS, RF, photonics, and device isolation
- Epitaxial silicon wafers for controlled device-layer thickness and doping
- Thermal oxide silicon wafers for insulation, masking, bonding, and device fabrication
- DSP silicon wafers for bonding, optics, MEMS, and double-sided processing
- High-resistivity silicon wafers for RF, microwave, detector, and photonic applications
Why Silicon Density Matters in Research
Silicon density is used to estimate wafer mass, model mechanical stress, calculate thermal behavior, and predict the performance of suspended structures, membranes, cantilevers, sensors, and other microfabricated components.
Density is especially important in MEMS engineering, where the mass of a silicon structure can influence resonant frequency, acceleration sensitivity, mechanical response, and device stability.
What Is the Density of Silicon?
The density of silicon is approximately 2.329 g/cm³ (2,329 kg/m³) at 20°C. This physical property describes how much mass is contained within a given volume of crystalline silicon and is one of the fundamental material properties used throughout semiconductor engineering.
Silicon owes its relatively low density to its diamond cubic crystal structure. Each silicon atom forms four covalent bonds with neighboring atoms, creating a strong yet lightweight crystal lattice that combines excellent mechanical stability with outstanding electronic performance.
Physical Properties Related to Silicon Density
| Property | Value |
|---|---|
| Density | 2.329 g/cm³ (2330 kg/m³) |
| Crystal Structure | Diamond Cubic |
| Atomic Number | 14 |
| Atomic Mass | 28.085 u |
| Melting Point | 1414°C |
| Thermal Conductivity | ~149 W/m·K |
Why Silicon Has This Density
Silicon atoms are arranged in an extremely regular three-dimensional crystal lattice. The spacing between atoms and the atomic mass of silicon determine the material's density. Unlike metals, silicon forms directional covalent bonds that create a rigid lattice while maintaining a relatively low overall mass.
This balance between strength and weight contributes to silicon's popularity in semiconductor wafers, MEMS devices, photonic components, sensors, integrated circuits, and photovoltaic technologies.
Why Silicon Density Matters
Accurate density values are essential throughout semiconductor manufacturing because they influence numerous fabrication and design processes.
- Crystal growth and ingot production
- Wafer grinding, polishing, and thinning
- Thermal stress calculations
- Finite element analysis (FEA)
- MEMS structural design
- Photolithography process modeling
- Thermal management simulations
- Package reliability analysis
Does Silicon Density Change?
Yes. Silicon density changes slightly with temperature because the crystal lattice expands as temperature increases. Although the variation is relatively small for most semiconductor applications, engineers account for thermal expansion when designing high-precision devices, power electronics, and space-based systems.
Silicon Compared with Other Semiconductor Materials
| Material | Density (g/cm³) | Typical Applications |
|---|---|---|
| Silicon (Si) | 2.33 | Integrated circuits, MEMS, solar cells |
| Germanium (Ge) | 5.32 | Infrared optics, detectors |
| Gallium Arsenide (GaAs) | 5.32 | RF electronics, lasers |
| Silicon Carbide (SiC) | 3.21 | Power electronics |
| Gallium Nitride (GaN) | 6.15 | LEDs, RF devices |
Applications That Depend on Silicon Density
- Silicon wafer manufacturing
- CMOS integrated circuits
- Microprocessors
- Power semiconductor devices
- MEMS sensors
- Photonic integrated circuits
- Solar cells
- Microfluidic devices
- University semiconductor research
Research Wafers for Material Characterization
UniversityWafer supplies silicon wafers, SOI wafers, epitaxial silicon wafers, thermal oxide wafers, and custom research substrates used for density measurements, materials characterization, MEMS fabrication, semiconductor process development, and device prototyping.