Substrates Used For Interposer
Interposer substrates are used in advanced semiconductor packaging to provide high-density electrical connections between chips, memory devices, and processors. UniversityWafer, Inc. supplies silicon wafers, borosilicate glass wafers, and glass panels for silicon interposers, glass interposers, through-silicon vias (TSVs), and next-generation 2.5D and 3D integrated circuits. Our substrates support research in high-performance computing, AI accelerators, photonics, and heterogeneous integration.
150 mm Silicon Wafers for Interposer and Mechanical Part Fabrication
Silicon wafers are commonly used to fabricate interposers, diced mechanical parts, thin silicon components, and advanced packaging test structures. For interposer research, engineers often request 150 mm wafers that can be thinned, diced, and processed into small precision parts.
UniversityWafer, Inc. supplies 6 inch silicon wafers, prime grade silicon wafers, and mechanical grade silicon wafers for interposer fabrication, thinning, dicing, packaging research, and mechanical applications.
Engineer Request: “I am interested in a quote for 5 pieces of 6 inch P-type (100) silicon wafers, 10-20 ohm-cm, single-side polished, 650 μm thick. I am flexible on material quality and would like to know if additional 6 inch wafers are available. The wafers will be used to create mechanical parts.”
The customer also asked whether mechanical grade silicon wafers could be thinned to 0.004 inch and diced into small interposer parts with final dimensions of approximately 0.004 inch × 0.016 inch × 0.200 inch.
Reference #115041 for specs and pricing.
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Borosilicate Glass Substrates for Glass Interposer Fabrication
Glass interposers are used in advanced semiconductor packaging because they can offer low electrical loss, dimensional stability, and a coefficient of thermal expansion close to silicon. Borosilicate glass and Borofloat-style glass materials are often selected for experimental glass interposer manufacturing, laser drilling, and through-glass via development.
UniversityWafer, Inc. supplies borosilicate glass wafers, glass wafers and panels, and related substrates for research, prototyping, and high-volume manufacturing development.
Process Engineer Request: “We are purchasing borosilicate glass plates because the coefficient of thermal expansion matches silicon well. Please confirm if your glass plates are borosilicate and provide a detailed specification list, including chemical composition and physical properties.”
The customer requested 0.5 mm and 0.4 mm borosilicate glass plates in 4 inch and 6 inch sizes for experimental glass interposer fabrication. They were also interested in larger 100 mm × 300 mm glass panels for future high-volume manufacturing.
For glass interposers, important specifications include CTE match to silicon, glass thickness, surface quality, optical absorption, chemical composition, and compatibility with laser drilling for through-glass vias.
Reference #129159 for specs and pricing.
What Is a Silicon Interposer?
A silicon interposer is an intermediate semiconductor substrate used in advanced packaging to electrically connect multiple integrated circuits (ICs), processors, memory devices, and chiplets. Silicon interposers enable high-density routing and short electrical paths, allowing devices to achieve higher bandwidth, lower power consumption, and improved signal integrity.
Silicon Interposer with Through-Silicon Vias (TSVs)
How Does a Silicon Interposer Work?
A silicon interposer acts as a bridge between chips and the package substrate. It contains microscopic wiring and through-silicon vias (TSVs), which are vertical electrical connections passing through the silicon wafer. These TSV structures provide efficient communication between multiple dies while reducing parasitic resistance and capacitance.
By shortening interconnect distances, silicon interposers enable faster data transfer and lower latency compared to conventional packaging methods.
Benefits of Silicon Interposers
- High-density electrical interconnections.
- Excellent signal integrity and reduced noise.
- Lower power consumption.
- Improved thermal management.
- Higher bandwidth between chips.
- Support for heterogeneous integration.
- Compact package size and miniaturization.
Applications of Silicon Interposers
Silicon interposers are widely used in 2.5D and 3D semiconductor packaging where multiple chips must communicate at extremely high speeds. Typical applications include:
- High-performance computing (HPC)
- Artificial intelligence processors
- Graphics processing units (GPUs)
- HBM memory integration
- Data centers and cloud computing
- Networking and telecommunications
- 5G and RF devices
- Military and aerospace electronics
Glass Interposers vs Silicon Interposers
Although silicon interposers dominate advanced packaging, glass interposers have attracted significant interest because they offer lower dielectric losses, excellent dimensional stability, and a coefficient of thermal expansion (CTE) close to silicon. Materials such as Borofloat® 33 glass and glass wafers are being investigated for next-generation packaging technologies.
Substrates Used to Fabricate Interposers
Several substrate materials are used for interposer fabrication depending on electrical, thermal, and mechanical requirements:
The Future of Interposer Technology
As semiconductor devices continue to evolve, interposer technology plays a critical role in enabling heterogeneous integration, chiplet architectures, and high-bandwidth memory systems. Silicon and glass interposers are expected to become increasingly important for artificial intelligence, advanced computing, photonics, and next-generation electronic systems requiring higher performance and lower power consumption.
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