We have a large selection of in stock quartz single and double side polished. We can also custom make your specs. Below are some recent z-cut quartz windows we've manufactured.
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Size: 25.4mm, 50.8mm, 76.2mm, 100mm diameter x 0.5 mm thickness
Polish: one side polished
Surface roughness: < 5 A ( by AFM)
Packing: in 1000 class clean room by wafer carrier
Some uses for Single crystal quartz wafers include microwave filters for wireless communication.
Single crystal z-cut quartz wafers are used to fabricate quartz resonators. The resonator is a device that vibrates at a certain frequency, and uses that vibration to send information. It is used in many applications, such as clocks, watches, radios, phones, computers, and many other devices. Quartz resonators are made of quartz crystal. They are very accurate because they vibrate at a very specific frequency. The resonator is usually attached to a circuit board. The whole circuit board might be put into another device that has an oscillator on it. The oscillator is the thing that makes the resonator vibrate at its specific frequency. The quartz resonators are used in tiny devices called microelectromechanical systems (MEMS). MEMS are used in many different types of devices, such as computer mice and keyboards, cell phones, video cameras, and automobile airbags. In these applications the MEMS are used as sensors to measure things like acceleration or position.
Recently, a few micromachining processes such as laser beam machining, abrasive jet machining (and electrochemical discharge machining have been studied for realizing micro-structures on quartz substrate.
Z-cut quartz etching used deep reactive ion etching (DRIE) system (GDE C200, China, Beijing), which has two high-density 13.56 MHz plasma sources (inductively coupled plasma (ICP) and capacitive coupled plasma (CCP), designed to etch materials which are infeasible to etch using conventional reactive ion etching (RIE) or ICP sources, such as silicon oxide, silicon nitride, aluminum oxide. The ICP source was a planar electrode on the top of the reaction chamber with a spiral coil. The ICP energy was supplied by electromagnetic inductions with a frequency of 13.56 MHz. The CCP source had the same frequency and was placed at the bottom of the reaction chamber. The cooled chuck with electrostatic clamping and helium backside cooling was served as a stage in which the target wafer was kept. The internal diameter of the reactor was 500 mm and the distance from the substrate chuck to the top of the reaction chamber was 150 mm. In this system the ICP produced the plasma of ions, while the CCP was applied to accelerate the ions onto the cathode. In order to guarantee the stability of the etching process, a chiller was used to control the temperature.
A scientists conducting research on PbSe Infrared Detectors. The scientist had the following question. The material that has been used in our industry for about 50 years is a “Z” cut single crystal quartz. The end product is used as cold as -50C so that is the “cut” that everyone has used as the Z cut allegedly has least expansion coefficient characteristics. The industry has used the same vendor all those years and my thought is that there would be a possibility that things may have changed over time. My fixtures to manufacture are based on 1.25” squares and as I mentioned we use over 2000 substrates a year. To explain the problem, I have a final product that the “chip” of quartz is about 1.5mm X 12.5mm on it are detectors that are 40 microns wide and 450 microns long, there are 256 of those detectors in a linear row along the 12.5mm… Over temperature some of the detectors do what we call “drift” where the electrical output does not stabilize… The odd thing is some drift for long periods of time, most detectors stabilize much quicker. When these detectors are packaged there is over $1500 of material and labor and with this “drift” problem they are useless. If the drift were happening with every part it would mean the problem was somewhere else but the fact that some do and some don’t in my mind points to substrate variation.. This question has come to the surface again as we sell just the array chips to a customer who packages them and they are seeing the same phenomenon which tells me that it is unlikely that we both have the same packaging problem…. I have been chasing this problem for 25 years and I want to try a different single crystal quartz to see if there is a difference. I appreciate you time looking at this….
PbSe films will not grow on silicon. 4” Z cut single crystal quartz will work.
We did discuss this internally, we think the angle of Z cut is the good choice for the lower cost, however, there is another angle cut called SC (double side rotation ) it's also a good cut for keeping the temperature no change . the short-come is the cost is high there is another possibility is happened while the fab of the wafers to lower the performance of the wafers
1) the tolerance of z- cut is too large , what's your specification at the tolerance of Z cut?
2) the parallelism of the 31.75X31.75 square wafer is not so good, this could damage the Z-cut angle's tolerance
Could you give a look of your specification, and we study if the tolerance your setup is right.
Companies that manufacture PbSe infrared detectors use single crystal z cut quartz over temperature ranging from 25C to 50C One of the longtime problems is what we call drift when the material is operated a cold temperatures This drift is a real problem with linear arrays with as many as 256 elements 40 microns wide and 450 microns long Where the real problem comes in is that some of these arrays drift forever and never stop changing and some are rock solid after a few hours of operation I suspect that there is something in the substrates that is different that might be causing this phenomenon One of the things I would like to try is to grow the material on single crystal quartz that is manufactured in a different way than the 50 year old method our industry has used since the 1960s Because of the specialty equipment to checkverify the wafers we can never know if we or anyone in our industry is getting the same material every time At this point and in the past there was no way for our industry to know what the effect of polaritypolarity or perpendicular to or parallel to the z axis to the final product We use approximately 1500 to 2000 125 wafers a year This is a problem for the last 25 years that I have been involved with this industry and hope to find the solution.
A scientist recently asked about which quartz wafers they should use for their Research.
I wonder whether you can customize the off-angle(6 degrees) of Quartz(SiO2) substrate, that is, "Z-cut with 6° off toward X-cut" and "Z-cut with 6° off toward Y-cut" or not. If possible, I want to get your quotation. Quartz(SiO2) single crystal substrate Orientation: "Z-cut with 6° off toward X-cut" or "Z-cut with 6° off toward Y-cut" Dimension: 34x5x2.0mm Polishing: Single side polished or Double side polished
If possible, please let me know how to confirm the orientation of the off-cut crystal after cutting
Z-cut with 6° off towards Y-cut or Z-cut with 6° off towards X-cut.
We quoted and the client purchased the following:
|34x5mm||Z-cut with 6° off toward X-cut||2.0mm||SSP||Quartz Crystal||SAW||seedless|
|34x5mm||Z-cut with 6° off toward X-cut||2.0mm||DSP||Quartz Crystal||SAW||seedless|