Substrates for Microfluidic Microfabrication 

Microfluidic microfabrication relies on high-quality polished silicon wafers to produce precise channels, chambers, membranes, and other microscale structures used in lab-on-a-chip devices, MEMS, biosensors, and analytical systems. UniversityWafer supplies silicon substrates in a variety of crystal orientations, resistivities, thicknesses, and surface finishes, including single-side polished (SSP), double-side polished (DSP), Float Zone (FZ), and Czochralski (CZ) silicon wafers for research, prototyping, and production.

UW Logo

Request a Quote for Microfluidic Silicon Wafers

UniversityWafer supplies polished silicon wafers for microfluidic microfabrication, MEMS, lab-on-chip devices, thermoplastic molding, biosensors, and semiconductor research. We offer high-quality silicon substrates with custom diameters, crystal orientations, resistivities, thicknesses, and polishing options to meet your exact process requirements.

Whether you need single-side polished (SSP), double-side polished (DSP), Float Zone (FZ), Czochralski (CZ), or silicon epitaxial wafers, our engineering team can recommend the best substrate for your microfabrication process.

Get Your Microfluidic Wafer Quote FAST! Or, Buy Online and Start Researching Today!





Typical Microfluidic Wafer Specifications

  • Single-Side or Double-Side Polished Silicon
  • <100> or <110> Crystal Orientation
  • P-Type, N-Type, or Doping Immaterial
  • Resistivity from 1–100 Ω-cm or custom
  • Standard thicknesses from 380 µm to 1 mm
  • Low TTV, Bow, and Warp for precision fabrication
  • Prime, Test, Mechanical Grade, and Epitaxial Wafers Available

Custom silicon wafers are available for university, government, and industrial research. Submit your specifications today for pricing, availability, and technical assistance.

Polished Silicon Wafers for Microfluidic Microfabrication

Polished silicon wafers are commonly used for microfluidic microfabrication, MEMS devices, lab-on-chip research, thermoplastic molding, and precision surface replication. A smooth silicon wafer surface can help create cleaner channels, membranes, orifices, and molded thermoplastic features when heat and pressure are applied.

For microfluidic molding applications, researchers often request thicker silicon wafers to reduce breakage during pressing. A wafer near 1 mm thick may be useful when mechanical strength is more important than standard wafer thickness.

Polished silicon wafer used for microfluidic microfabrication

Recommended Silicon Wafer Specifications

  • Material: Silicon, P-type or N-type
  • Diameter: 3 inch, 76.2 mm, 100 mm, or custom sizes
  • Thickness: Standard 380 µm, or thicker wafers near 1 mm for added strength
  • Orientation: <100> for common anisotropic etching; <110> for deep trenches with vertical walls
  • Resistivity: 1–100 Ω-cm is suitable for many non-electrical microfluidic applications
  • Polish: Single-side polished (SSP) or double-side polished (DSP)
  • TTV: <10 µm standard; <5 µm or better for tighter fabrication control

When to Choose SSP or DSP Silicon

Single-side polished silicon wafers are usually adequate when only one surface is used as the mold or fabrication surface. Double-side polished silicon wafers are useful when both sides of the wafer must be patterned, bonded, inspected, or used for optical alignment.

Dopant and Resistivity for Microfluidics

If the wafer is used mainly as a smooth mold surface, the dopant type may not matter. In that case, specify doping immaterial instead of undoped silicon to avoid unnecessary cost. If your process depends on electrochemical etching, etch stops, or device electrical behavior, specify P-type boron-doped silicon or N-type phosphorus-doped silicon with the required resistivity.

Etching and Crystal Orientation

Microfluidic channels and MEMS structures are often formed using anisotropic etching. <100> silicon wafers are commonly used for general microfabrication, while <110> silicon wafers may be preferred for deep trenches or features requiring more vertical walls.

Example Wafer Used for Microfluidic Research

Item Material Orientation Diameter Thickness Polish Resistivity Comment
6413 P/B <100> 3 inch 380 µm SSP 5–10 Ω-cm SEMI Prime, 2 flats, Empak cassette, TTV <5 µm

Reference #240748 for specifications and pricing.

Need a polished silicon wafer for microfluidics? Send UniversityWafer your required diameter, thickness, polish, orientation, resistivity, and quantity for a fast quote.

Related Microfluidics & Silicon Wafer Resources